Motorola Corporation

Brian R Kemper

Dennis Brian Miller

Grace M O'Malley

Mark X Stavropoulos

Jeffery T Barylak

A microelectronic assembly (,), such as a smart card, is formed by attaching a component subassembly (,) to a substrate (,). The substrate (,) includes a face (,) and defines a via (,) having a via opening (,) at the face (,). The substrate (,) further defines a component cavity (,) at the face (,) that is spaced apart from the via (,). An electrical element (,), such as a wound antenna, is disposed within the substrate (,) and includes a terminal (,) at the via (,). The component subassembly (,) is formed by mounting an integrated circuit component (,) onto a metallic lead (,). The integrated circuit component (,) is electrically connected to the metallic lead (,) by a wire lead (,). A protuberance (,) is connected to the metallic lead (,), preferably by forming a loop from a wire bond. A polymeric body (,) is formed about the component (,) and wire leads (,). The component subassembly (,) is superposed onto the substrate (,), and the component (,) is received in the component cavity (,). The metallic lead (,) is affixed to the face (,) and overlies the via opening (,). The protuberance (,) extends into the via (,) and contacts a conductive body (,) within the via (,). The conductive body (,) electrically connects the protuberance (,) and the terminal (,).

Microelectronic assembly with connection to a buried electrical element, and method for forming same

A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26) and overlies the via opening (30). The protuberance (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the protuberance (20) and the terminal (24).

Microelectronic assembly with connection to a buried electrical element,

A microelectronic assembly (10) is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26). An electrical element (14) is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A leg (20) is formed by deforming a portion of the metallic lead (18). A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26). The leg (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the leg (20) and the terminal (24).

Microelectronic assembly for connection to an embedded electrical

The output terminals (15, 16) of an analog sensor (14) are monitored by a microprocessor (17). The microprocessor is DC coupled to a main analog ground terminal (16) of the sensor, while also separately being connected to a main power ground terminal (13) at which ground reference potential is provided to the microprocessor. A resistor (38), a semiconductor switch (36) and a printed circuit board metalization trace (35) provide a normal low resistance connection between the main analog sensor ground terminals (20) and the main power ground terminal (13). Current sensing circuitry (33) limits the current passed through the low resistance connection and thereby prevents excessive current from damaging printed circuit board metalization paths (34, 35) connecting the sensor analog ground terminal (16) to the main power ground terminal (13). Also, additional circuitry (32) is provided for independently sensing the voltage at the main analog sensing ground terminal (20) and preventing an excessive voltage at this terminal from being coupled (via 22) to the microprocessor. During non fault operation, the above provides low resistance, low offset voltage connections between the sensor output terminals (15, 16) and the microprocessor (17).

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Mount Prospect, IL, United States of America

Brian R Kemper