General Electric Company

Brian Patrick Hoden

Hendrik Pieter Jacobus De Bock

Shakti Singh Chauhan

Joo Han Kim

Stanton Earl Weaver, Jr

Tao Deng

James Neil Johnson

Graham Charles Kirk

Binoy Milan Shah

Jay Todd Labhart

Pramod Chamarthy

Stuart Connolly

Jerry L Wright

Michelle Ann Parziale

Stanton Earl Weaver Jr

A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.

Circuit card assembly including heat transfer assembly and method of manufacturing such

A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

Circuit card assembly and method of manufacturing thereof

An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.

Electronics chassis and method of fabricating the same

Growing community of inventors

Huntsville, AL, United States of America

Brian Patrick Hoden