Intel Corporation

Brian P Kelly

David W Browning

Md Altaf Hossain

Michael J Kasper

Cliff C Lee

Itai M Pines

The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.

Microelectronic substrate for alternate package functionality

In accordance with various aspects of the disclosure, a method and apparatus are disclosed that includes aspects of monitoring a first processor of a computer by a monitoring module for a first processor instability; determining if the first processor is stable based on the monitored first processor instability; routing operational priority to a second processor of the computer through a multiplexer module if the first processor is determined not to be stable, wherein a first interface of the first processor and a second interface of the second processor are in communication with the multiplexer module and wherein the first processor and the second processor are in communication by a processor interconnect; and operating the computer using the second processor.

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Hillsboro, OR, United States of America

Brian P Kelly