Foster-miller, Inc.

Other

Brian P Farrell

Malcolm E Taylor

Paul Jaynes

Richard B Streeter

Justyna B Teverovsky

Robert F Kovar

Joseph Ting

Nelson Landrau

David J Edell

Thomas G Campbell

Richard Czerw

Carole Ann Winterhalter

Richard A Covel

Daniel L Fischbach

Pat Coppola

Charles Carey

John Gannon

Edward Joseph Tierney

Patricia Wilson

Thomas Tiano

Jeremy Bowman

Patricia Wilson Nguyen

Jeremiah Slade

Sean Gerald O'Reilly

Mara Powell

Joseph F Burke

Wendy B Horowitz

William E Dorogy, Jr

John J Gannon, Jr

A PALS compliant routing system includes flexible fabric cabling routed through the webbing of a PALS grid. A first connector or device is coupled to the cabling. Other connectors coupled to the cabling subsystem include a retention mechanism configured to retain them in the channels of the PALS webbing.

PALS compliant routing system

A pocket on the garment is configured to store an audio playback device. A device dock is associated with the pocket. The device dock includes an audio connector connectable to the audio playback device. A jack dock is on the garment. The jack dock includes a headphone jack configured to connect to a headphone. An elongated stretchable textile data/power bus is integrated with the garment between the device dock and the jack dock.

Wearable audio cable management system

A dual function composite system includes a first electronic subsystem, a second electronic subsystem, and a composite member between the first and second electronic subsystems. The composite member includes plies of fabric, and resin impregnating the plies of fabric. At least one ply of the fabric includes signal transmission elements integrated therewith and interconnecting the first electronic subsystem with the second electronic subsystem.

Dual function composite system and method of making same

A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.

Chip package sealing method

Carbon nanotube-based devices made by electrolytic deposition and applications thereof are provided. In a preferred embodiment, the present invention provides a device comprising at least one array of active carbon nanotube junctions deposited on at least one microelectronic substrate. In another preferred embodiment, the present invention provides a device comprising a substrate, at least one pair of electrodes disposed on the substrate, wherein one or more pairs of electrodes are connected to a power source, and a bundle of carbon nanotubes disposed between the at least one pair of electrodes wherein the bundle of carbon nanotubes consist essentially of semiconductive carbon nanotubes. In another preferred embodiment, a semiconducting device formed by electrodeposition of carbon nanotubes between two electrodes is provided. The invention also provides preferred methods of forming a semiconductive device by applying a bias voltage to a carbon nanotube rope. The plurality of metallic single-wall carbon nanotubes are removed (e.g., by application of bias voltage) in an amount sufficient to form the semiconducting device. The devices of the invention include, but not limited to, chemical or biological sensors, carbon nanotube field-effect transistors (CNFETs), tunnel junctions, Schottky junctions, and multi-dimensional nanotube arrays.

Carbon nanotube-based electronic devices made by electrolytic deposition and applications thereof

A physiological monitoring garment includes first and second elastic fabric portions. An elongate stretchable textile data/power bus is disposed between the first and second elastic fabric portions. The elongate stretchable textile data/power bus includes a plurality of integral conductors, woven, knitted, or braided along the length thereof. One or more sensors are connected to the elongate stretchable textile data/power bus.

Physiological monitoring garment

A packaging method including assembling components on a substrate, manufacturing a lid assembly to include a plurality of integrated covers, and mating the lid assembly to the substrate.

Electronic and optoelectronic component packaging technique

A package including a substrate, a plurality of components on the substrate, and a lid assembly including a plurality of integrated covers for at least select components on the substrate. A method of manufacturing such a lid assembly is also disclosed as is a packaging method.

A method of manufacturing a fabric article to include electronic circuitry in which a flex circuit is assembled to include conductive traces and pads on a flexible substrate, a fabric article is placed on a rigid surface, and the substrate of the flex circuit is secured to the fabric article. Also disclosed is a fabric article which includes electronic circuitry and an electrically active textile article.

Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article

A knitted, woven, or braided textile ribbon including fibers and having a length and selvage edges and one or more transmission elements running the length of the ribbon in place of one or more of the fibers and integrated with the fibers to transmit data and/or power along the length of the ribbon.

Wearable transmission device

An implantable medical device (IMD) is disclosed that is formed on a substrate composed of liquid crystal polymer (LCP). In one embodiment, the IMD can be an interconnection module for interconnecting an electrode array to an equipment module. The interconnecting module includes conductors disposed on the LCP substrate and coupled to the electrode array, and wherein the conductors are encapsulated using a silicone or LCP encapsulant. In another embodiment, the IMD is an electrode array and interconnect module disposed on an integral LCP substrate. An equipment module can be coupled to the interconnect module. Alternatively, a hybrid electronic circuit can be coupled to the interconnect module for signal processing and conditioning signals received from the electrode array or for providing stimulus signals to the electrode array. In this embodiment, all of the conductors and at least a portion of the electrodes in the electrode array are encapsulated using a silicone or LCP encapsulant. In another embodiment, the IMD is an electrode array, an interconnecting module, and a hybrid circuit that are disposed on an LCP substrate. The interconnecting module is used to provide signal paths to and from the electrodes in the electrode array to the hybrid circuit. In this embodiment, all of the conductors, the hybrid electronic circuit and at least a portion of the electrodes in the electrode array are encapsulated using a silicone or LCP encapsulant.

Implantable devices having a liquid crystal polymer substrate

A plant hanger is provided for adjustably supporting an article, such as a potted plant and a plant holder along a vertical axis. The plant hanger includes a first piece having an elongated body provided with a support arrangement spaced therealong, and a hook at one end thereof adapted to be suspended from a support structure. A second piece has a series of flexible rods provided at one end with bent portions adapted to engage and support the plant holder and provided at the other end with a common hook bracket adapted to be engaged with the support arrangement.

Plant holder

The present invention provides polyester/vinyl dioxolane based coating compositions containing no or essentially no volatile organic components. Oligomers for forming the coating compositions of the present invention are vinyl dioxolane end-capped polyester oligomers.

Growing community of inventors

Bayside, WI, United States of America

Brian P Farrell