Genxcomm, Inc.

Orca Computing Limited

Brian Mattis

Taran Huffman

Thien-An Nguyen

Bryan Woo

Hussein Nili

George Palmer

Jason Andrach

Farzad Mokhtari-Koushyar

A method of co-manufacturing silicon waveguides, SiN waveguides, and semiconductor structures in a photonic integrated circuit. A silicon waveguide structure can be formed using a suitable process, after which it is buried in a cladding. The cladding is polished, and a silicon nitride layer is disposed to define a silicon nitride waveguide. The silicon nitride waveguide is buried in a cladding, and annealed. Thereafter, cladding above the silicon waveguide structure can be trenched through, and low-temperature operations can be performed to or with an exposed surface of the silicon waveguide structure.

Co-manufacturing of silicon-on-insulator waveguides and silicon nitride waveguides for hybrid photonic integrated circuits

A signal generator includes a photonic circuit configured to output a sequence of solitons at a known rate. The solitons illuminate a high-speed photodiode that, in response, generates an electrical signal, such as a sinusoidal signal, which can be provided as input to a direct digital synthesizer configured to output successive phases of a selected waveform in response to electrical stimulus.

Hybrid photonic integrated circuits for ultra-low phase noise signal generators

A dicing system and methods may include a novel way to separate die on a wafer in preparation for packaging that results in smooth diced edges. This is specifically advantageous, but not limited to, edge-coupled photonic chips. This method etches from the front side of the wafer and dices from the back side of the wafer to create a complete separation of die. It creates an optically smooth surface on the front side of the wafer at the location of the optical device (waveguides or other) which enables direct mounting of adjacent devices with low coupling loss and low optical scattering. The backside dicing may be wider than the front side etch, so as to recess this sawed surface and prevent it from protruding outward, resulting in rough surfaces inhibiting a direct joining of adjacent devices.

Saw assisted facet etch dicing

Growing community of inventors

Austin, TX, United States of America

Brian Mattis