General Electric Company

Ge Aviation Systems Limited

Transportation IP Holdings, LLC

Ge Global Sourcing LLC

Brian Magann Rush

William Dwight Gerstler

Nicholas William Rathay

Corey Bourassa

Stefano Angelo Mario Lassini

Karthik Kumar Bodla

Gregory Alexander Natsui

Daniel Jason Erno

Naveenan Thiagarajan

Andrew Thomas Cross

Stefano Lassini

Hendrik Pieter Jacobus De Bock

Andrew Louis Krivonak

Weijun Yin

Nathaniel Benedict Hawes

Shreenath Shekar Perlaguri

Rajendra Yammanuru

Arunpandi Radhakrishnan

Christopher James Kapusta

Arun Virupaksha Gowda

Douglas Carl Hofer

Todd Garrett Wetzel

David Richard Esler

Thomas Charles Adcock

Richard Anthony Eddins

Michael Jay Grutkowski

Liqiang Yang

Judd Everett Swanson

Narendra Digamber Joshi

Stanton Earl Weaver, Jr

Slawomir Rubinsztajn

Charles Erklin Seeley

Pazhayannur Ramanathan Subramanian

Timothy John Sommerer

Renato Guida

Konrad Roman Weeber

Theodore Clark Brown

Brian Gene Brzek

Mark Howard Giammattei

Mahadevan Balasubramaniam

Warren Lee

Stanton Earl Weaver

Liang Yin

Loucas Tsakalakos

Lana Maria Osusky

David Sirda Shanks

James William Sears

James Fredric Wiedenhoefer

Vandana Prabhakar Rallabandi

Joo Han Kim

Gary Dwayne Mandrusiak

Boon Kwee Lee

Joseph John Zierer

Sudeep Mandal

Faisal Razi Ahmad

Rinaldo Luigi Miorini

Anoop Kumar Jassal

Gary Mandrusial

Devices and methods are provided herein useful to thermal management. In some embodiments, a thermal management device includes a housing with a fixed amount of working fluid disposed therein. The substrate is in thermal communication with the thermal management device such that evaporation of the working fluid controls the temperature of the substrate. Evaporated working fluid exits the housing through one or more vents. The housing further includes a plurality of supports that increase the surface area to volume ratio of the housing. The high surface area to volume ratio of the housing increases the rate of heat transfer and also minimizes or otherwise reduces the size and weight of the thermal management device. The supports may further serve to mechanically support the substrate, enabling the housing to act as a combined thermal and mechanical device.

Evaporative thermal management systems and methods

An ultrasound probe is presented. The ultrasound probe includes an ultrasound probe handle. Moreover, the ultrasound probe also includes a phase change chamber monolithic with respect to a portion of the ultrasound probe handle, where the phase change chamber includes hermetic chamber walls extending around and defining an enclosed chamber and a material disposed within the hermetic chamber walls, where the material is configured to change phase in response to heat from a component of the ultrasound probe.

Ultrasound probe and method of making the same

The disclosure relates to an apparatus for connecting an electronic component to a conductor. A housing includes at least one slot and defines at least one component chamber for carrying the electronic component. A liquid coolant can pass through the housing. A pair of conductive members extends from the housing through the at least one slot and can be releasably inserted into a channel defined in a support assembly. The support assembly facilitates an electrical connection between the conductive members and corresponding conductive contact members connected to a respective power supply or electrical load. The support assembly can provide an inward sealing force to a seal on the housing circumscribing the pair of conductive members.

Electronic connection assembly

A power overlay (POL) module includes a semiconductor device having a body, including a first side and an opposing second side. A first contact pad defined on the semiconductor device first side and a dielectric layer, having a first side and an opposing second side defining a set of first apertures therethrough, is disposed facing the semiconductor device first side. The POL module, includes a metal interconnect layer, having a first side and an opposing second side, the metal interconnect layer second side is disposed on the dielectric layer first side) and extends through the set of first apertures to define a set of vias electrically coupled to the first contact pad. An enclosure defining an interior portion is coupled to the metal interconnect layer first side, and a phase change material (PCM) is disposed in the enclosure interior portion.

Power overlay module with thermal storage

According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

Systems and methods for using additive manufacturing for thermal management

An electric motor may include a stator assembly comprising a stator housing, and one or more rotors coupled to the stator by a rotor shaft assembly. The stator housing may include a cooling structure that has a plurality of cooling body portions and a plurality of cooling conduits defined by the plurality of cooling body portions. A method of forming a stator housing for an electric machine may include additively manufacturing a stator housing that includes a cooling structure defining a fluid domain, coupling a working fluid source to the stator housing and introducing a working fluid into the fluid domain defined by the cooling structure, and sealing the cooling structure with the working fluid contained within the fluid domain of the cooling structure. A method of cooling an electric machine may include heating the working fluid in the fluid domain and flowing the working fluid through the fluid domain, and transferring heat from the cooling structure to a cooling fluid flowing along one or more cooling surfaces contacting a surface of the electric machine.

Cooling a stator housing of an electric machine

A cooling system includes a conduit extending from an upstream end to a downstream end and retains a gas. A heat exchanger is fluidly coupled with and disposed within a surface of the conduit. A portion of the gas is directed into the heat exchanger via one or more passages extending between the conduit and the heat exchanger, and a portion of the gas is directed out of the heat exchanger via the one or more passages. The heat exchanger directs cooling fluid in one or more directions within the heat exchanger along one or more passageways of plural passageways. The heat exchanger directs the portion of the gas in one or more directions within the heat exchanger along one or more other passageways of the plural passageways. The heat exchanger cools the gas by exchanging heat from the gas to the cooling fluid within the heat exchanger.

Cooling system for an engine assembly

The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

Liquid-cooled assembly and method

A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a thermal enhancement feature can enhance a heat transfer from the outer wall at the leading edge to the outer wall within the condenser section of the vapor chamber.

System and method for cooling a leading edge of a high speed vehicle

A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.

Conformal heat pipe assemblies

A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.

Additively manufactured structures for thermal and/or mechanical systems, and methods for manufacturing the structures

A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a thermal energy storage reservoir positioned within the vapor chamber contains a phase change material for absorbing thermal energy.

A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a dual-modal cooling structure can enhance heat transfer from the outer wall at the leading edge to the outer wall within the condenser section of the vapor chamber.

A hypersonic aircraft includes one or more leading edge assemblies that are designed to cool the leading edge of certain portions of the hypersonic aircraft that are exposed to high thermal loads, such as extremely high temperatures and/or thermal gradients. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. A coolant supply may be in fluid communication with at least one fluid passageway that passes through the outer wall to deliver a flow of cooling fluid to the stagnation point. In addition, a nose cover is positioned at least partially over or within the at least one fluid passageway and is formed from a material that ablates or melts when the leading edge is exposed to a predetermined critical temperature, the nose cover being configured for restricting the flow of coolant until the nose cover is ablated or melted away.

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Niskayuna, NY, United States of America

Brian Magann Rush