Texas Instruments Corporation

Brian M Smith

Emanuel D Torti

An interconnection system for high density I/O sites on an I.C. Interconnection substrate allowing field replacement thereof has a socket body with an array of contact springs adapted to be removably biased into engagement with conductive pads on the bottom surface of the substrate. The contact springs have a tail portion depending from the socket body which are affixed to a printed board. The substrate is locked into place on the socket body by removable latches.

Growing community of inventors

Mansfield, MA, United States of America

Brian M Smith