Hughes Electronics Corporation

Hughes Aircraft Company

Brian M Punsly

Ralph D Hermansen

Wai-Cheng Seetoo

William E Elias

Thomas G Wong

Andre Wallace

A family of adhesives is provided for bonding cyanate ester composite articles together which is also plateable with metal once chemically etched. The adhesives comprise a polymeric matrix and a filler of metal powder or metal flakes. The polymeric matrix comprises at least one polyepoxide resin and at least one curing agent. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure in air at a temperature less than 125&deg; C. Thereafter, the surface of the assembly is chemically etched and then plated with metal. The present adhesives enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines. A cyanate ester resin structure assembled with the present adhesive composition may, upon plating, replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive and comprehensive metallic coating.

Metal-filled, plateable structural adhesives for cyanate ester composites

A method is provided for preparing the surface of a cyanate ester resin composite for metal plating. More particularly, a layer consisting essentially of cyanate ester resin is applied to the surface of the composite. Thereafter, the surface of the resin layer is etched, preferably by treatment with an etching solution containing either a quaternary ammonium hydroxide or a primary amine. Upon completion of the etching process, the cyanate ester resin layer may be successfully plated with metal. The method of the invention operates to improve adhesion between the cyanate ester resin composite and a subsequently-plated metal by providing the composite with a homogenous distribution of mechanical anchoring sites for a subsequently-plated metal, such that uniformity of adhesion is achieved. A cyanate ester resin composite prepared for plating in accordance with the invention may, upon plating, replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive metallic coating.

Cyanate ester films that promote plating adhesion to cyanate ester

An adhesive is provided for bonding cyanate ester composite parts together which is also plateable with metal once chemically etched. The adhesive comprises a polymeric matrix and a filler of cyanate ester polymer. The polymeric matrix comprises at least one polyepoxide resin and a curing agent, while the cyanate ester polymer filler is present in the adhesive as a powder. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure at room temperature. Thereafter, the surface of the assembly is chemically etched and then plated with metal. The present adhesive enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines. A cyanate ester resin structure assembled with the present adhesive composition may, upon plating, replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive and comprehensive metallic coating.

Growing community of inventors

Torrance, CA, United States of America

Brian M Punsly