Dow Global Technolgoies LLC

Brian M Habersberger

Hong Yang

Weiming Ma

Yuyan Li

Chao He

Yunfeng Yang

Hongyu Chen

Bharat Indu Chaudhary

Yabin Sun

Colin LiPiShan

Yonghua Gong

Lisa S Madenjian

Johnathan E DeLorbe

Johnathan E Delorbe

Thomas Wesley Karjala, Jr

Colin Lipishan

Gaoxiang Wu

A composition for use as a film layer comprises (A) an olefin-based polymer having a volume resistivity greater than 5.0*10ohm·cm; (B) a hydrophobic-treated fumed silica; (C) an alkoxysilane; (D) an organic peroxide; and (E) from 0 wt % to 1.5 wt % of a crosslinking co-agent.

PV module with film layer comprising hydrophobic-treated fumed silica

A composition for use as a film layer comprises (A) an olefin-based polymer having a volume resistivity greater than 5.0*10ohm·cm; (B) a hydrophilic fumed silica; (C) an alkoxysilane; (D) an organic peroxide; and, optionally, (E) from 0 wt % to 1.5 wt % of a crosslinking co-agent.

PV module with film layer comprising hydrophilic fumed silica

A composition comprising the following components a)-c): a) an alpha composition comprising a multimodal ethylene/alpha-olefin interpolymer, and wherein the alpha composition comprises the following properties: i) an Mz/Mn≥8.0, ii) a density from 0.855 to 0.890 g/cc, iii) a V100 (100° C.)≤2,000 Pa·s, iv) a V1.0 (100° C.)≥15,000 Pa·s, v) a Mn≥16,000 g/mol; b) a peroxide; and c) a silane coupling agent.

Ethylene/alpha-olefin interpolymer based compositions with improved balance of cure and processability

The present disclosure relates to a curable composition for an encapsulant film, the curable composition comprising: (A) a polyolefin; (B) a fumed alumina; (C) an organic peroxide; (D) a silane coupling agent; (E) a crosslinking co-agent; and, optionally, (F) an additive component comprising a UV stabilizer, wherein the polyolefin has a volume resistivity of less than 4.0E+15 ohm·cm. The present disclosure further relates to an encapsulant film made from such a curable composition and a PV module containing such an encapsulant film.

Photovoltaic encapsulant films comprising fumed alumina

An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer having a density of 0.850 g/cc to 0.890 g/cc; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising triallyl phosphate.

Non-polar ethylene-based compositions with triallyl phosphate for encapsulant films

An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a compound of Structure I wherein R-Reach is independently selected from the group consisting of hydrogen, a C-Chydrocarbyl group, a C-Csubstituted hydrocarbyl group, and combinations thereof. 

Non-polar ethylene-based polymer compositions for encapsulant films

The present disclosure provides an article. In an embodiment, the article includes a first structural component and a second structural component. The first structural component includes a polycarbonate composition. The second structural component includes a polymeric blend of (i) an ethylene/&#x3b1;-olefin multi-block copolymer, and (ii) a functional polymer modifier that is an ethylene/ester copolymer. The second structural component is adhered to the first structural component.

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Freeport, TX, United States of America

Brian M Habersberger