Apple Inc.

Brian M Gable

James A Yurko

Eric W Hamann

Abhijeet Misra

Hoishun Li

Christopher D Prest

James A Wright

William A Counts

Isabel Yang

Brian P Demers

Henry B Wettersten

Anthony D Prescenzi

Fletcher R Rothkopf

Mattia Pascolini

Michael Benjamin Wittenberg

Colin M Ely

Erik G De Jong

Naoto Matsuyuki

Jayesh Nath

Jason C Sauers

Lee E Hooton

Carlo Di Nallo

James A Curran

Adam Thomas Clavelle

Brian S Tryon

Richard Hung Dinh

Mario Martinis

Rex Tyler Ehman

Zheyu Wang

Michael M Li

Zechariah D Feinberg

Todd S Mintz

Herng-Jeng Jou

Yoshihiko Yokoyama

Lijie Bao

Yi Chun Chen

Weiming Huang

Charles J Kuehmann

Dakota A Bass

Aaron D Paterson

Jeremy Li

Michael P Coleman

Katie L Sassaman

Craig A Horton

Graeme W Paul

Chune-Ching Young

Chun-Hsien Chiang

Rafael Yu

Anuj Datta Roy

Susannah P Calvin

Jennifer D Schuler

A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.

Additively manufactured device enclosures

A 3D printed metallic structure can include an elongated body defining an orifice, the elongated body divisible into a plurality of sectioned elements. The plurality of sectioned elements configured for use a housing or enclosures of electronic devices.

Direct metal deposition of electronic device components

A method of forming a unitary sintered body can include cutting a first portion and a second portion from a sheet of feedstock. The feedstock can include ceramic or metallic particles suspended in a binder. The first portion can be positioned in contact with the second portion and the portions can be sintered together to form the unitary body.

Additive manufacturing methods for components

The disclosure provides an aluminized composite including a base material. The aluminized composite may also include a diffusion layer disposed over the base material. The aluminized composite may further include an aluminum material disposed over the diffusion layer.

Coloring of metallic materials coated with aluminum

The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.

Recycled aluminum alloys from manufacturing scrap with cosmetic appeal

Anodic oxide coatings that provide corrosion resistance to parts having protruding features, such as edges, corners and convex-shaped features, are described. According to some embodiments, the anodic oxide coatings include an inner porous layer and an outer porous layer. The inner layer is adjacent to an underlying metal substrate and is formed under compressive stress anodizing conditions that allow the inner porous layer to be formed generally crack-free. In this way, the inner porous layer acts as a barrier that prevents water or other corrosion-inducing agents from reaching the underlying metal substrate. The outer porous layer can be thicker and harder than the inner porous layer, thereby increasing the overall hardness of the anodic oxide coating.

Oxide coatings for providing corrosion resistance on parts with edges and convex features

An electronic device such as a wristwatch may include a conductive housing. A corrosion-resistant coating may be deposited on the conductive housing. The coating may include transition layers and an uppermost alloy layer. The transition layers may include a chromium seed layer on the conductive housing and a chromium nitride layer on the chromium seed layer. The uppermost alloy layer may include TiCrCN or other alloys and may provide the coating with desired optical reflection and absorption characteristics. The transition layers may include a minimal number of coating defects, thereby eliminating potential sites at which visible defects could form when exposed to salt water. This may allow the electronic device to exhibit a desired color and to be submerged in salt water without producing undesirable visible defects on the conductive housing structures.

Electronic devices having corrosion-resistant coatings

Anodized substrates having laser markings and methods for forming the same are described. According to some embodiments, the methods involve forming a feature on a substrate using a laser prior to anodizing. The laser energy and pulse width can be chosen so as to provide a particular topology to a surface of the substrate that, after anodizing, absorbs incoming light and imparts a dark appearance to the feature. In some cases, the methods involve forming a coarse oxide layer, which is removed prior to anodizing. Since the laser marking is performed prior to anodizing, the anodized substrates are free from laser-induced cracks, thereby making the anodized substrates more corrosion resistant than conventional laser-marked anodized substrates. The techniques are well suited for forming features on consumer products that may be exposed to water or other corrosion-inducing agents.

Anodized substrates with dark laser markings

The disclosure provides an aluminum alloy including having varying ranges of alloying elements. In various aspects, the alloy has a wt % ratio of Zn to Mg ranging from 4:1 to 7:1. The disclosure further includes methods for producing an aluminum alloy and articles comprising the aluminum alloy.

Aluminum alloys with high strength and cosmetic appeal

A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

Coupling structures for electronic device housings

Growing community of inventors

San Jose, CA, United States of America

Brian M Gable