Lam Research Corporation

Cepheid Corporation

Visx, Inc.

Snap-on Inc.

Snap-on Technologies, Inc.

Amo Manufacturing Usa, LLC

Brian M Bliven

Roy Winston Pascal

Ronald G Chang

David A Jackson

Michael Ravkin

Steven M Montgomery

Gregory E Mote

Douglas Grant Gardner

Kingman Yee

Dimitri A Chernyak

Charles E Campbell

Junzhong Liang

Seema Somani

Charles R Munnerlyn

Stephen Mark Smith

Patrick O'Mahony

Paul Jordan

Jeffrey Jonathan Persoff

Michael J Kling, Iii

Hoshang Shroff

John Weberg

David Turnquist

Steven Glickman

Walter Huff

Cary Spediacci

Waste receptacle with lid

A handling system for high throughput processing of a large volume of biological samples is provided herein. Such systems can include an array support assembly that supports multiple diagnostic assay modules in an array having at least two dimensions, a loader that loads multiple diagnostic assay cartridges within the multiple diagnostic assay modules. The array support assembly can be movable relative the loader to facilitate loading and unloading so as to provide more efficient processing.

Sample processing module array handling system and methods

A wavefront sensor enhances calibration of a laser ablation system, such as a laser eye surgery system, by measuring one or more characteristics of an ablated test surface. Typically, light is passed through the ablated test surface, and the light is analyzed to determine the test surface characteristics. In some embodiments, the ablated test surface is positioned along a treatment plane. In some embodiments, light is passed through a wavefront sensor, such as a Hartmann-Shack sensor, to convert the light into electrical signals. A processor then converts the electrical signals into data, such as surface maps showing high-order aberrations and/or artifacts on the test surface, refractive power measurements, shape measurements, and the like. Generated data may then be used to calibrate a laser surgery system.

Wavefront calibration analyzer and methods

A sterile hand held slit lamp for laser refractive surgery includes a charging base that charges a battery while a hand held slit lamp is positioned thereon. A sterile supple cover is positioned over a slit lamp handle while supported by the charging base. A sterile gloved operator grasps the slit lamp handle covered by the sterile cover and illuminates an eye with a slit lamp beam. In many embodiments, an operating microscope provides a view of the eye to an operator while the slit lamp beam illuminates the eye. Operator adjustable controls located on the slit lamp handle are manipulated through a sterile cover and control a length, a width and an intensity of the slit lamp beam. An operator wearing sterile gloves adjusts a position of a piece of tissue near an incision, and removes debris from a surgical incision in tissue after viewing the eye illuminated with the hand held slit lamp beam.

Sterile hand held refractive surgery slit lamp illumination system

The present invention provides systems and methods for filtering particles and assisting gas flow management within laser systems. In one embodiment, a laser apparatus () includes an elongate laser chamber defining a chamber cavity () and an electrode structure () disposed therein. The electrode structure includes an anode () spaced apart from a cathode (). The laser includes an elongate baffle () disposed in the laser chamber. The baffle is adapted to arrest a plurality of particles generated within the chamber. In this manner, the baffle operates as a passive filtration system to help filter particles generated within the chamber during laser operation, and may further provide gas flow management capabilities.

Passive gas flow management and filtration device for use in an excimer or transverse discharge laser

A position determination system comprises a first measuring apparatus and a second measuring apparatus. The first measuring apparatus includes a first sensing device having a sensing field for obtaining positional data of a first testing target, a calibration target rigidly linked to the first sensing device, wherein the positional relationship between the first sensing device and the calibration target is known. The system has a repositioning mechanism for repositioning the sensing field of the first sensing device. The second measuring apparatus includes a second sensing device having a sensing field for obtaining positional data of a second testing target, a calibration sensing device rigidly linked to the second sensing device for obtaining positional data of the calibration target, wherein the positional relationship between the second sensing device and the calibration sensing device is known, and a repositioning mechanism for repositioning the sensing field of the second sensing device. Depending on different needs, the repositioning mechanism readjust the viewing fields of the sensing devices such that the testing targets are properly within the sensing fields of the sensing devices.

Self-calibrating position determination system

An edge roller assembly includes first and second grip rings. The grip rings are held together in an opposing relationship such that outer surfaces thereof define a groove for receiving an edge of a substrate. The grip rings may be O-rings formed of a rubber material. In one embodiment, the grip rings are held together by lower and upper clamp plates that are adjustably fastened together so that the clamping forces exerted on the substrate can be controlled. The upper clamp plate may have a height adjustment knob for adjusting the height of the edge roller assembly mounted thereon. A method for contacting an edge of a substrate and a transport system for transporting semiconductor wafers to a wafer processing station also are described.

Edge roller assembly, method for contacting an edge of a substrate, and transport system for transporting semiconductor wafers to a wafer processing station

Techniques are disclosed for providing a system that has a plurality of devices in which the position of a device of the plurality of devices relative to another device of the plurality of devices is self-calibrated. In one embodiment, the system is a five-camera aligner for use in aligning motor vehicle wheels. In this embodiment, the aligner includes a first camera pod having two alignment cameras and a calibration camera, and a second camera pod having another two alignment cameras and a calibration target. Because the aligner has four alignment cameras and a calibration camera, the aligner is often referred to as a five-camera aligner. For illustration purposes, the first camera pod is herein referred to as the left camera pod and the second camera pod is herein referred to as the right camera pod. In one embodiment, the left camera pod is placed to the left of the aligner, and the right camera pod is placed to the right of the aligner. The two alignment cameras of the left camera pod focus at the two left wheels of the vehicle under alignment, while the two alignment cameras of the right camera pod focus at the two right wheels of the same vehicle. In addition, the calibration camera on the left pod focuses at the calibration target mounted in the right camera pod. In one embodiment, the relative positions of the elements (alignment camera, calibration camera, and calibration target) in each camera pod are pre-calibrated. Consequently, the aligner is fully calibrated when the position of the left camera pod to the right camera pod is measured. Further, the calibration camera is configured such that it periodically measures the position of the left camera pod relative to the right camera pod, rendering the aligner a self-calibrated aligner.

Self-calibrating 3D machine measuring system useful in motor vehicle wheel alignment

A bowl includes a bottom wall having a generally circular shape. A sidewall extends upwardly from the bottom wall to define a cylindrical chamber. The sidewall has a projection that extends into the cylindrical chamber. The projection has a top surface that defines a step in the cylindrical chamber and a sloped surface that extends between the top surface and an inner surface of the sidewall. The top surface of the projection is sloped slightly downwardly. The sloped surface of the projection is oriented relative to the top surface such that extensions of the top surface and the sloped surface define an angle in a range from about 30 degrees to about 45 degrees. A spin, rinse, and dry module including the bowl and a method for loading a semiconductor wafer into a spin, rinse, and dry module also are described.

Bowl, spin, rinse, and dry module, and method for loading a semiconductor wafer into a spin, rinse, and dry module

A wheel for a conveyor system for transporting semiconductor wafers includes a first section for supporting a semiconductor wafer at a first level and a second section for supporting the wafer at a second level, with the first level being higher than the second level. In one embodiment, each of the first and second sections is semicircular. The first level may be substantially the same as a level at which the wafer is subjected to a wafer cleaning operation, and the distance the second level is below the first level may be in a range from about one sixteenth of an inch to about three sixteenths of an inch. A conveyor system for transporting wafers and a method for transferring wafers from a conveyor system to a wafer processing station also are described.

Wheel and conveyor system for transporting semiconductor wafers

A brush core and method of making a brush core are provided. The brush core is configured to be implemented in substrate preparation systems. The brush core is connected between a first end and a second end of a non-rotating shaft. A motor is contained within the brush core for rotating the brush core around the non-rotating shaft. The first end and the second end are each capable of being adjusted to calibrate and position the brush core. The calibrated position of the brush core can be set to compensate for a skewed substrate, or to achieve a desired pressure application profile over the substrate.

Wafer scrubbing brush core having an internal motor and method of making the same

In a method for controlling airflow on a backside of a semiconductor wafer during spin processing, a wafer backing plate is first disposed below a semiconductor wafer. Air is then supplied to the volume defined by the wafer backing plate and the semiconductor wafer. The air may be supplied to the volume through a hollow core spindle, a rotary union, or apertures in the wafer backing plate. The separation distance between the wafer and the wafer backing plate and the flow rate of air supplied to the volume may be controlled to avoid any substantial recirculation of contaminated air into the volume. In addition to serving as one of the boundaries that define the volume, the wafer backing plate reduces particle recontamination on the backside of the wafer by preventing particles from contacting the backside of the wafer during spin processing.

Method for controlling airflow on a backside of a semiconductor wafer during spin processing

Method for transferring wafers from a conveyor system to a wafer processing station

Bowl for processing semiconductor wafers

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San Jose, CA, United States of America

Brian M Bliven