General Electric Company

Brian Lynn Rowden

Eladio Clemente Delgado

Ljubisa Dragoljub Stevanovic

John Stanley Glaser

Richard Alfred Beaupre

Christopher James Kapusta

Arun Virupaksha Gowda

Antonio Caiafa

Glenn Scott Claydon

Ahmed Elasser

Ramanujam Ramabhadran

Kum-Kang Huh

A modular electronics package is disclosed that includes a first and second electronics packages, with each of the first and second electronics packages including a metallized insulating substrate and a solid-state switching device positioned on the metallized insulating substrate, the solid-state switching device comprising a plurality of contact pads electrically coupled to the first conductor layer of the metallized insulating substrate. A conductive joining material is positioned between the first electronics package and the second electronics package to electrically connect them together. The first electronics package and the second electronics package are stacked with one another to form a half-bridge unit cell, with the half-bridge unit cell having a current path through the solid-state switching device in the first electronics package and a close coupled return current path through the solid-state switching device in the second electronics package in opposite flow directions.

Low inductance stackable solid-state switching module and method of manufacturing thereof

A power module includes a first bus bar having a first plurality of tabs, wherein each of the first plurality of tabs is electrically coupled to a respective conductive trace of a plurality of conductive traces disposed on a first side; a second bus bar having a second plurality of tabs, wherein each of the second plurality of tabs is electrically coupled to a respective conductive trace of a plurality of conductive traces disposed on a second side; and a third bus bar having a third plurality of tabs, wherein at least one tab of the third plurality of tabs is electrically coupled to a respective conductive trace of the plurality of conductive traces disposed on the first side and at least one tab of the third plurality of tabs is electrically coupled to a respective conductive trace of the plurality of conductive traces disposed on the second side.

Power module

A method and system for a power module is provided. The power module includes a first substrate including a first conductive substrate having a first plurality of power semiconductor switches arranged thereon, and at least one second conductive substrate electrically coupled to the first conductive substrate. A first terminal is electrically coupled to the first conductive substrate. The power module also includes a second substrate including a third conductive substrate having a second plurality of power semiconductor switches arranged thereon, and at least one fourth conductive substrate electrically coupled to the third conductive substrate. The third conductive substrate is electrically coupled to the second conductive substrate. A second terminal is electrically coupled to the fourth conductive substrate.

Robust low inductance power module package

A method and system for a power module device is provided. The device includes a base, a circuit board including a plurality of gated switches formed of a semiconductor material, and an electrical bus member configured to connect to a voltage source having a first polarity. The bus member includes a length that is substantially greater than a width of the bus member and the width is substantially greater than a thickness of the bus member. The power module device also includes a second bus member configured to connect to a voltage source having a second polarity. The second bus member is positioned in a nested face-to-face configuration with respect to the first bus member. The power module device further includes a layer of electrical insulation positioned between the first bus member and the second bus member.

System for a low profile, low inductance power switching module

A surface mount package includes at least one semiconductor device and a POL packaging and interconnect system formed about the at least one semiconductor device that is configured enable mounting of the surface mount package to an external circuit. The POL system includes a dielectric layer overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias formed through the dielectric layer so as to be electrically coupled to connection pads on the semiconductor device(s). A metallization layer is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate is positioned on a second surface of the semiconductor device(s), with the double-sided ceramic substrate being configured to electrically isolate a drain of the semiconductor device(s) from an external circuit when the surface mount package is joined thereto and to conduct heat away from the semiconductor device(s).

Low profile surface mount package with isolated tab

An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.

Power module package

Integrated power module package

A flexible power connector is presented. An embodiment of a flexible power connector includes a stacked structure having one or more insulating strips alternatingly arranged with a plurality of conducting strips, wherein the one or more insulating strips are interposed between the plurality of conducting strips to insulate each conducting strip from the other conducting strip in the stacked structure, and wherein the plurality of conducting strips is disposed parallel and proximate to each other to reduce electrical losses in the stacked structure

Flexible power connector

A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.

Growing community of inventors

Ballston Lake, NY, United States of America

Brian Lynn Rowden