Intel Corporation

Brian Leung

Simon C Steely, Jr

Richard J Dischler

Benjamin Keen

William J Butera

David Bach

Christian Karl

Olivier Franza

Simon C Steely Jr

Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.

Layered super-reticle computing : architectures and methods

Layered super-reticle computing: architectures and methods

Growing community of inventors

Quincy, MA, United States of America

Brian Leung