University of California

Lv Sensors, Inc.

Brian Lee Bircumshaw

Albert P Pisano

Oliver M O'Reilly

Curtis A Ray

Janusz Bryzek

Elizabeth Logan

The present invention provides a tire pressure sensor system that has multiple functions and is integrated into a small package. The system includes one or more Micro Electro Mechanical System (MEMS)-based sensors, including a MEMS-based pressure sensor; a MEMS-oscillator-based wireless signal transmitter; and a microcontroller, where the microcontroller processes the data generated by at least one of the MEMS-based sensors, controls at least one of the MEMS-based sensors, and controls the encoding and timing of transmission of data from the wireless signal transmitter. Preferably, the MEMS-based sensors, MEMS-oscillator-based wireless signal transmitter, and microcontroller are integrated onto one or more chips in one or more packages. The system also preferably includes a MEMS-based motion sensor, a low frequency (LF) receiver, an IC-based voltage sensor, a voltage regulator, a temperature sensor and a polarization voltage generator. Thus, the disclosed tire pressure sensor system is high in functionality, yet small in size.

Integrated tire pressure sensor system

A MEMS resonater employs a bulk longitudinal resonating mass supported by opposing tethers above a substrate with primary capacitive plates spaced from end surfaces of the resonating mass and supported on the substrate. Any number of secondary capacitive plates can be spaced from side surfaces of the resonating mass for detecting transverse vibrations. The secondary capacitive plates can be shaped to conform to the mode of the transverse vibration. The sensor is readily fabricated using a two-mask self-aligned process, or a one-mask self-aligned process with timed etch.

MEMS resonator and method of making same

A MEMS resonator includes an annular resonator body defined by an inner radius and an outer radius, a first electrode positioned within the inner radius and spaced from the resonator body, and a second electrode positioned around the annular resonator body and spaced from the outer radius. The first electrode and the second electrode provide for capacitive drive of the resonator body and capacitive sense of the resonator body. Piezo-resistive sense and piezoelectric drive/sense techniques can also be utilized. The overall extent can be smaller than 1 cmin area and positioned on a supporting substrate by a plurality of anchors. The substrate can comprise an RF transceiver integrated circuit with the anchors connecting the drive electrode and sense electrode to the integrated circuit. The resonator is readily fabricated using conventional semiconductor integrated circuit fabrication techniques.

Growing community of inventors

Berkeley, CA, United States of America

Brian Lee Bircumshaw