International Business Machines Corporation

Infineon Technologies North America Corp.

Brian L Ji

Leland Chang

Chung H Lam

Robert K Montoye

Louis L Hsu

Toshiaki Kirihata

Robert H Dennard

Louis C Hsu

Amlan Majumdar

Li-Kong Wang

Seiji Munetoh

Gary S Ditlow

Louis L C Hsu

Karl David Selander

Chorng-Lii Hwang

Jeffrey W Sleight

Josephine B Chang

Chung-Hsun Lin

Wilfried Haensch

Jin Cai

Steven John Koester

Bipin Rajendran

Michael Anthony Sorna

Mark B Ketchen

Howard Hao Chen

Wing Kin Luk

James Stephen Mason

Manjul Bhushan

Steven John Zier

Dmitry G Netis

Karen M G V Gettings

Katherine Lynn Saenger

Fei Liu

Arvind Kumar

Jeng-Bang Yau

Richard Stephan Wise

Louis Lu-Chen Hsu

Wayne Frederick Ellis

Bomy A Chen

Conal Eugene Murray

Gary Dale Carpenter

Hon-Sum Philip Wong

Gerhard Mueller

Leathen Shi

Hongwen Yan

David R Hanson

Siddhartha Panda

Oliver Weinfurtner

William F Washburn

Michael A Soma

Yujon Li

Wonyoung Kim

Robert Kevin Montoye

Robert Heath Dennard

Toshiaki K Kirihata

Integrated circuits having combined memory and logic functions are provided. In one aspect, an integrated circuit is provided. The integrated circuit comprises: a substrate comprising a silicon layer over a BOX layer, wherein a select region of the silicon layer has a thickness of between about three nanometers and about 20 nanometers; at least one eDRAM cell comprising: at least one pass transistor having a pass transistor source region, a pass transistor drain region and a pass transistor channel region formed in the select region of the silicon layer; and a capacitor electrically connected to the pass transistor.

Embedded DRAM integrated circuits with extremely thin silicon-on-insulator pass transistors

A reversible, switched capacitor voltage conversion apparatus includes a plurality of individual unit cells coupled to one another in stages, with each unit cell comprising multiple sets of inverter devices arranged in a stacked configuration, such that each set of inverter devices operates in separate voltage domains wherein outputs of inverter devices in adjacent voltage domains are capacitively coupled to one another such that a first terminal of a capacitor is coupled to an output of a first inverter device in a first voltage domain, and a second terminal of the capacitor is coupled to an output of a second inverter in a second voltage domain; and wherein, for both the first and second voltage domains, outputs of at least one of the plurality of individual unit cells serve as corresponding inputs for at least another one of the plurality of individual unit cells.

Voltage conversion and integrated circuits with stacked voltage domains

A method of forming a field effect transistor (FET) capacitor includes forming a channel region; forming a gate stack over the channel region; forming a first extension region on a first side of the gate stack, the first extension region being formed by implanting a first doping material at a first angle such that a shadow region exists on a second side of the gate stack; and forming a second extension region on the second side of the gate stack, the second extension region being formed by implanting a second doping material at a second angle such that a shadow region exists on the first side of the gate stack.

Bi-directional self-aligned FET capacitor

A low voltage signaling system for integrated circuits includes a first voltage domain operating at a nominal integrated circuit (IC) power supply voltage (Vdd) swing level at a signal transmitting end of a first chip, a second voltage domain having one or more transmission interconnect lines operating at a reduced voltage swing level with respect to the first voltage domain, and a third voltage domain at a signal receiving end of a second chip, the third voltage domain operating at the Vdd swing level; wherein an input signal originating from the first voltage domain is down converted to operate at the reduced voltage swing level for transmission over the second voltage domain, and wherein the third voltage domain senses the input signal transmitted over the second voltage domain and generates an output signal operating back up at the Vdd swing level.

Low voltage signaling

An on-chip voltage conversion apparatus for integrated circuits includes a first capacitor; a first NFET device configured to selectively couple a first electrode of the first capacitor to a low side voltage rail of a first voltage domain; a first PFET device configured to selectively couple the first electrode of the first capacitor to a high side voltage rail of the first voltage domain; a second NFET device configured to selectively couple a second electrode of the first capacitor to a low side voltage rail of a second voltage domain, wherein the low side voltage rail of the second voltage domain corresponds to the high side voltage rail of the first voltage domain; and a second PFET device configured to selectively couple the second electrode of the first capacitor to a high side voltage rail of the second voltage domain.

Switched capacitor voltage converters

A converter circuit and methods for operating the same. The converter circuit includes a supply voltage, a capacitor, an inductor, and four stacked switching elements. Each switching element is adjustable from a low resistance state to a high resistance state by a control signal. The inductor outputs current to a circuit load. The circuit may be operated in a first mode such that the output is adjustable between the supply voltage and half the supply voltage. Alternatively, in a second mode of operation, the output is adjustable from half the supply voltage to a ground voltage.

Integratable efficient switching down converter

A three-dimensional (3D) chip stack structure and method of fabricating the structure thereof are provided. The 3D chip stack structure includes a plurality of vertically stacked chips which are interconnected and bonded together, wherein each of the vertically stacked chips include one or more IC device strata. The 3D chip stack structure further includes an air channel interconnect network embedded within the chip stack structure, and wherein the air channel interconnect network is formed in between at least two wafers bonded to each other of the vertically stacked wafers and in between at least two bonded wafers of the vertically stacked wafers at a bonding interface thereof. In addition, the 3D chip stack structure further includes one or more openings in a peripheral region of the chip stack structure that lead into and out of the air channel interconnect network, so that air can flow into and out of the air channel interconnect network through the one or more openings to remove heat from the chip stack structure.

Air channel interconnects for 3-D integration

An integrated circuit (IC) system includes a plurality of ICs configured in a stacked voltage domain arrangement such that a low side supply rail of at least one of ICs is common with a high side supply rail of at least another of the ICs; a reversible voltage converter coupled to power rails of each of the plurality of ICs, the reversible voltage converter configured for stabilizing individual voltage domains corresponding to each IC; and one or more data voltage level shifters configured to facilitate data communication between ICs operating in different voltage domains, wherein an input signal of a given logic state corresponding to one voltage in a first voltage domain is shifted to an output signal of the same logic state at another voltage in a second voltage domain.

A content addressable memory device with a plurality of memory cells storing ternary data values of high, low, and don't care. An aspect of the content addressable memory device is the use of first memory elements and second memory elements in the memory cells. The first and second memory elements are electrically coupled in parallel circuit to a match-line. The first memory elements are coupled to first word-lines and the second memory elements are coupled to second word-lines. The first memory elements are configured to store low resistance states if the ternary data value is low and high resistance states if the ternary data value is either high or don't care. The second memory elements are configured to store the low resistance states if the ternary data value is high and the high resistance states if the ternary data value is either low or don't care.

Ternary content addressable memory using phase change devices

A memory device for performing logical operations on two or more input variables includes a match line and first and second memory cells. The first and second memory cells collectively include a first, second, third and fourth memory element. The first, second, third and fourth memory elements may have either a first value or a second value programmed therein and wherein the first, second, third and fourth memory elements are programmed to either the high or low resistive values based on a particular logic function to be performed.

Content addressable memory array programmed to perform logic operations

A memory device for storing one or more addresses includes a match line and first and second memory cells that form a 2-bit memory cell. Each memory cell includes two memory elements coupled to a match line and selection lines coupled thereto. The selection lines provide a signal representative of a logical combination of at least two different inputs.

Content addressable memory array

A fully depleted semiconductor-on-insulator (FDSOI) transistor structure includes a back gate electrode having a limited thickness and aligned to a front gate electrode. The back gate electrode is formed in a first substrate by ion implantation of dopants through a first oxide cap layer. Global alignment markers are formed in the first substrate to enable alignment of the front gate electrode to the back gate electrode. The global alignment markers enable preparation of a virtually flat substrate on the first substrate so that the first substrate can be bonded to a second substrate in a reliable manner.

Back-gated fully depleted SOI transistor

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Fishkill, NY, United States of America

Brian L Ji