International Business Machines Corporation

Globalfoundries Inc.

Lenovo (Singapore) Pte. Ltd.

Brian L Carlson

John Richard Dangler

Kevin Albert Splittstoesser

Roger Scott Krabbenhoft

Jeffrey A Taylor

Joseph Paul Kuczynski

Eric Vance Kline

Mark Kenneth Hoffmeyer

Bruce John Chamberlin

Matthew Stephen Kelly

Ahmad D Katnani

Wayne J Rothschild

Gregory S Killinger

A circuit apparatus includes a first circuit feature upon a first insulator and a second circuit feature upon the first insulator. The first circuit feature includes a planarized surface and the second circuit feature includes an irregular surface. The first circuit feature and the second circuit feature may be formed from patterning a conductive sheet that is upon the first insulator. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions thereof and is maintained in second regions thereof. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

Insertion loss reduction and increased bonding in a circuit apparatus

A circuit apparatus includes at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

An apparatus includes a spray module with at least one column of spray nozzles. Each spray nozzle is configured to deliver a processing substance on a semiconductor substrate during a process for semiconductor manufacturing as the semiconductor substrate moves past the spray module. The at least one column of spray nozzles is arranged with respect to a direction of travel of the semiconductor substrate so the semiconductor substrate passes the spray nozzles. A location module identifies a location of the semiconductor substrate with respect to the spray module. A spray pattern module determines a spray pattern of where a processing substance is to be delivered to the semiconductor substrate and a nozzle control module actuates each spray nozzle independently based on the spray pattern and a location of the semiconductor identified by the location module.

Digital processing equipment

Process of fabricating printed circuit board

A method is provided for implementing reduction of drill smear in drilling a multilayer substrate such as a rigid printed circuit board or flex to minimize or eliminate the need to remove drill smear and for improved via and interconnect reliability. An inert liquid is applied to the multilayer substrate and a drill bit prior to and during the drill process to cool and lubricate the multilayer substrate and the drill bit to reduce drill smear.

Implementing reduced drill smear

Sensors are located on first and second regions of a heat sink, with a portion of the heat sink interposed between the first and second region sensors. The heat sink is connected to a component by an attachment that conducts heat from the component to the heat sink, and a third sensor is located on the component or the attachment with a portion of the attachment disposed between the third sensor and the first and second heat sink region sensors. Temperature readings from the sensors are compared to identify a failing one of the heat sink, the attachment portion, and the component with respect to heat conduction, which includes identifying the interposed heat sink portion as failing in response to a divergence between temperature inputs from the first and second heat sink region sensors. Rate-of-rise temperature readings may also be observed and compared, including to historical values.

Growing community of inventors

Rochester, MN, United States of America

Brian L Carlson