Qualcomm Mems Technologies, Inc.

Idc, LLC

Frore Systems Inc.

Brian James Gally

William J Cummings

Clarence Chui

Manish Kothari

Lauren Palmateer

Ming-Hau Tung

Suryaprakash Ganti

Jeffrey Brian Sampsell

Seshagiri Rao Madhavapeddy

Philip Don Floyd

Mark W Miles

Prabhu Sathyamurthy

Lior Kogut

Vikram Mukundan

Gang Xu

Marc Mignard

Denis H Endisch

Ananth Saran Yalamarthy

Yeh-Jiun Tung

Chih-Wei Chiang

Russell Wayne Gruhlke

Ion Bita

Marek Mienko

Wen-Jian Lin

Brian W Arbuckle

Shekhar Halakatti

Leonard Eugene Fennell

John Batey

Prathima Kapa

Ming Tung

Alan G Lewis

Narayana Prasad Rayapati

Mark Mienko

Sangkyu Kim

Yongkang Tang

A method for providing a cooling system is described. The method includes providing a plurality of sheets. Each sheet includes at least one structure for a level in each cooling cell of a plurality of cooling cells. A particular level of each cooling cell includes a cooling element having a first side and a second side. The cooling element is configured to undergo vibrational motion to drive fluid from the first side to the second side. The method also includes aligning the sheets, attaching the sheets to form a laminate that includes the cooling cells, and separating the laminate into sections. Each section includes at least one cooling cell.

Method for fabricating MEMS-based cooling systems

A system including a plurality of cooling cells is described. Each of the cooling cells includes a support structure and a cooling element. The cooling element has a central region having an axis and a perimeter. The cooling element IS supported by the support structure at the central region and along the axis. At least a portion of the perimeter being unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. A portion of the cooling cells aligned along the axis are physically connected such that the cooling cells form an integrated cooling cell tile.

Tiles having multiple cooling cells for MEMS-based cooling

A heat transfer system includes fluid transfer cells that vibrationally move a fluid and a thermally conductive cover that conducts heat from the cells while avoiding transfer of mechanical energy between the cells. A fluid transfer module includes outer and inner walls, a support member, and a membrane. The outer wall has an outer opening. The inner wall has an inner opening. The support member is disposed laterally on the inner wall such that a flow chamber is defined between the outer and inner walls. The membrane is supported by the support member along the outer wall. A fluid transfer module includes an inlet port and an actuator. The actuator undergoes vibrational motion and has first and second vibrational modes. The first vibrational mode causes fluid to enter the inlet port. The second vibrational mode expels fluid from the inlet port, which reduces clogging of the inlet port.

Cover for MEMS-based cooling systems

A system including a tile and a hood is described. The tile includes a plurality of cooling cells. Each of the cooling cells includes a support structure and a cooling element. The cooling element is supported by the support structure and is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The hood is coupled to the tile and directs the fluid around the plurality of cooling cells.

Hood for MEMS-based cooling systems

A method for providing a piezoelectric device is described. The method includes providing a first electrode layer on a substrate and coating at least one layer of piezoelectric material. The coating using at least one of slot-die coating, dip coating, aerosol coating and R2R coating such that a layer of the at least one layer of piezoelectric material has a variation in thickness of not more than ten percent. The layer(s) of piezoelectric materials are also heat treated. Multiple layers of piezoelectric material may be slot-die coated and heat treated to provide a multilayer having the desired thickness. A second electrode layer is provided on the layer(s) of piezoelectric material.

Method and system for fabricating a piezoelectric device

A system including an orifice plate, a fan element and at least one channel is disclosed. The orifice plate has at least one orifice therein. The fan element is configured to undergo vibrational motion to drive a fluid through the orifice(s). The fluid is drawn through the channel(s) in response to the fluid being driven through the at least one orifice.

MEMS-based airflow system having a vibrating fan element arrangement

A mobile device case is described. The mobile device case includes a housing configured to retain a mobile device and an active cooling system integrated into the housing. The active cooling system configured to use vibrational motion to cool a surface of the mobile device.

Mobile device case including an active cooling system

A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Electromechanical device with optical function separated from mechanical and electrical function

A multi-state light modulator comprises a first reflector. A first electrode is positioned at a distance from the first reflector. A second reflector is positioned between the first reflector and the first electrode. The second reflector is movable between an undriven position, a first driven position, and a second driven position, each having a corresponding distance from the first reflector. In one embodiment, the three positions correspond to reflecting white light, being non-reflective, and reflecting a selected color of light. Another embodiment is a method of making the light modulator. Another embodiment is a display including the light modulator.

Method and device for multistate interferometric light modulation

An ornamental display device having at least one interferometric modulator, a signal receiver configured to receive an external signal and a processor configured to control the display based on the external signal is disclosed. In one aspect, the external signal is emitted from a controller. In another aspect, the external signal is emitted from a computer.

Display device

In various embodiments described herein, a display device includes a front illumination device that comprises a light guide disposed forward of an array of display elements, such as an array of interferometric modulators, to distribute light across the array of display elements. The light guide panel may include a turning layer to deliver uniform illumination from a light source to the array of display elements. For many portable display applications, the light guide panel comprises the substrate used in fabricating the display elements. The light guide panel may include additional films as well. The light guide panel, for example, may include a diffuser and/or an optical isolation layer to further enhance the optical imaging characteristics of the display.

Display device having front illuminator with turning features

A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

Method of making an electronic device with a curved backplate

Methods of fabricating an electromechanical systems (EMS) device with spacers between plates and EMS devices formed by the same are disclosed. In one embodiment, a EMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier may be released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the EMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The resulting EMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

Methods of fabricating MEMS with spacers between plates and devices formed by same

Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

Method and system for packaging MEMS devices with glass seal

A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

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Los Gatos, CA, United States of America

Brian James Gally