Tektronix, Inc.

Brian J Wood

Clark W Crawford

James D Buehler

Ted E Deur

Richard Marantz

Peter M Compton

Jerome P Gianotti

Ice pack

A discrete ink level sensing system according to the present invention includes a level sensing probe (130) with at least first and second level sensing pads (178, 180) that is placed in an ink reservoir (28). The level sensing system uses electrical conductivity of the ink to detect when the upper surface level of the ink is lower than the lowest points of the level sensing pads. The upper and lower level sensing pads are electrically connected by a sense resistor (182). A voltage sensor (174) detects across the sense resistor a voltage that depends on the ink conductivity and the position of an upper surface level of the ink with respect to the lowest points of the first and second level pads. The value of the voltage is sent to a CPU (154) that signals a user that a predetermined amount of ink should be added to the reservoir.

Ink level sensing probe system for an ink jet printer

A FRU assembly (10) comprises a melt chamber (20) including multiple subchambers (30) in which sticks of phase change ink (38, 40) are inserted and melted. Melted ink flows through apertures (54) to a reservoir (28) comprising multiple compartments (56). Each compartment contains a channel (90) and a siphon plate (114) that allow a siphon action that siphons melted ink in the compartments to an orifice (100) that leads to an ink jet print head (16). Heaters (52, 82, and 142) under the control of a CPU (154) melt the ink and keep the melted ink at a desired temperature during various modes of operation.

Method and apparatus for providing phase change ink to an ink jet printer

A high density connector in which the conductive leads of at least two circuit boards, two flexible circuits, or one of each are interconnected directly without the use of a traditional molded connector with pins captured therein. This is accomplished by overlapping the two boards with the conductive paths on each to be interconnected facing each other. An anisotropic elastomeric polymer material is inserted between the boards and then the sandwich is clamped together compressing the polymer material to provide a low electrical resistance path therethrough to interconnect the conductive paths on the respective circuit boards. One disclosed embodiment utilizes backing plates above and below the sandwich with a plurality of screws passing through registration holes to align the conductive paths and to provide closure of the connector. The other disclosed embodiment is designed to interconnect two boards along substantially the full width of the boards. This is accomplished with clamping bars that have thumb screws at either end and at selected spacings along the length of the clamping bars to ensure closure between the two boards. The thumb screws here also pass through registration holes in the sandwich to align the conductive paths. Further, bosses are included around each of the thumb screw holes in the clamping bars to align the boards.

High density connector design using anisotropically pressure-sensitive

A cable strain relief clamp assembly to securely hold a bundle of flat cables while providing quick assembly/disassembly from the main unit chassis. Identical clamp halves are positioned and fastened at a specified location on the cable bundle. The clamp (with the attached cable) is then snapped onto a bracket to become a subassembly unit. The bracket mates with the main unit chassis utilizing a snap fit detail oriented perpendicular to typical cable axial forces, thus fixing the cables in place. Accommodating varied thicknesses and numbers of cables can be accomplished by varying the aperture of the clamp. The clamp may also provide an electrical ground path between cable and chassis. Other features of the present invention are that: (1) multiple cables and varied widths can be accomplished; (2) it can be detached from main unit chassis without use of fasteners; (3) it does not depend on termination of the cables in male/female relationship; and (4) a consistent part outline is provided for all applications.

Detachable cable strain relief clamp

A modularized packaging system for enclosing circuit components of an electronic instrument. That system includes one or more 'C' frame modules each having top, bottom and side wall portions interconnected one to the other orthogonally. In addition, there is provided interconnection means for interconnecting, side by side, as many of the 'C' frame modules as desired with a side panel provided for closing the outwardly facing open sides, if any, of the outermost 'C' frame modules. To complete the package, front and rear end assemblies are provided to close those portions of the interconnected 'C' frame modules.

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Hillsboro, OR, United States of America

Brian J Wood