Texas Instruments Corporation

Brian J Love

Robert K Peterson

Burhan Ozmat

Robert J Gordon

An electronic system having a first printed wiring board, a first integrated circuit carrier positionable on the printed wiring board and a substrate having a central portion formed of ceramic material. The substrate central portion has a specific thermal conductivity greater than 1.5.times.10.sup.-5 Wm.sup.2 /g.degree.C. The substrate may comprise a ceramic material formed in combination with a modifier of the type which increases fracture toughness thereby inhibiting crack initiation and growth. In an alternate form of the invention the elctronic system includes a substrate having a central portion formed of ceramic material and first and second opposing surfaces each clad with a metallic layer of predetermined thickness. The combination of the substrate and the bonded wiring boards provide an effective coefficient of thermal expansion to each wiring board which is sufficiently close to the coefficient of thermal expansion of the carriers so as to prevent solder joint cracking during operation of the system.

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Dallas, TX, United States of America

Brian J Love