Intel Corporation

Sanyo Denki Co., Ltd.

Brian J Long

Paul J Gwin

Bilal Khalaf

John G Meyers

Rolf A Konstad

Sireesha Gogineni

Peter A Davison

Tomoaki Ikeda

Masayuki Iijima

Masashi Miyazawa

Kouji Ueno

Electronic device package technology is disclosed. In one example, a connector for coupling an electronics sub-assembly to an electronics assembly includes a connector body. The connector body has a sub-assembly interface and a circuit board interface. The connector body has at least one passive electronic component that is necessary for operating the sub-assembly, thereby maximizing available space for computational components on the sub-assembly. The connector body can comprise two separate bodies wherein the passives are contained between the bodies. At least one extension cable can electrically couple the connector to the sub-assembly. A method of making an electronics assembly, capable of receiving a sub-assembly via a connector, comprises providing an assembly circuit board having an electrically coupled connector with at least one passive electronic component.

Electronics connectors having power-regulating passive components

Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.

Thermal conductivity for integrated circuit packaging

A case suitable for solid state memory is described that offers enhanced cooling. In one example, a memory case includes a base, a cover having a plurality of fins on a top of the cover, channels between the fins, defined by the fins, and a ramp extending from a front on the top of the cover to the channels, and an inner cavity defined by the base and the cover to house a solid state memory.

Solid state memory case with enhanced cooling

Aspects of the disclosure are directed to an edge card that includes a printed circuit board having a top side and a bottom side. The top side of the printed circuit board can include one or more top-side circuit components, and a plurality of top-side metal contact fingers, at least some of the top-side metal contact fingers electrically connected to at least one of the one or more circuit components. The bottom side of the printed circuit board can include one or more bottom-side circuit components. The bottom side of the printed circuit board can also include a substrate interposer having a top side and a bottom side. The top side of the substrate interposer can include one or more passive circuit components at least partially embedded in the substrate interposer, and one or more solder balls arranged around the one or more passive circuit components.

Frame embedded components

Techniques and mechanisms to facilitate connection with one or more integrated circuit (IC) dies of a packaged device. In an embodiment, the packaged device includes a first substrate coupled to a first side of a package, and a second substrate coupled to a second side of the package opposite the first side. Circuitry, coupled via the first substrate to one or more IC dies disposed in the package, includes a circuit structure disposed at a cantilever portion of the first substrate. The cantilever portion extends past one or both of an edge of the first side and an edge of the second side. In another embodiment, a hardware interface disposed on the second substrate enables coupling of the packaged device to another device.

Packaged integrated circuit device with cantilever structure

Electronic device and housing for such devices are described and claimed. In one example a housing comprises a first end cap dimensioned to fit within a first open end of the housing and comprising a first bracket having a first cam surface positioned to engage the second surface of the printed circuit board when the first end cap is inserted into the first open end of the housing. Inserting the first end cap into the first open end of the housing causes the first cam surface to urge the printed circuit board in a direction which compresses the first heat generating component against an interior surface of the housing.

Electronic device

In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.

Liquid cooling system

A small water-cooling type electronic component cooling apparatus is provided. The electronic component cooling apparatus comprises a so-called water-cooling heat sink, a radiatorcooled by an electric fan, first and second coolant pathsfor circulating a coolant between the heat sinkand the radiator, and an electric pumpto supply a moving energy to the coolant. The electric pumpis arranged at a position facing the heat-radiating portion of the radiator

Electronic component cooling apparatus

A cooling system hinge mounted to a portion of an enclosure of an electronic system to which a cooling device may be releasably and pivotably attached in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover to close the enclosure.

Growing community of inventors

Folsom, CA, United States of America

Brian J Long