Hewlett-packard Company

Hewlett-packard Development Company, L.p.

Winthrop D. Childers

Brian J. Keefe

Paul H. Mcclelland

Steven W. Steinfield

Kenneth E. Trueba

Brian J Keefe

Winthrop D Childers

Steven Warren Steinfield

Joseph Edward Scheffelin

Kenneth E Trueba

Janis Horvath

Ali Emamjomeh

Kenneth J Courian

Jules G Moritz

Terri I Chapman

Paul H McClelland

David K McElfresh

May F Ho

Mohammad Akhavain

Ellen R Tappon

William R Knight

Noah C Lassar

James W Ring

Lawrence H White

Mark A Devries

Roger J Kolodziej

Steven L Webb

Paul Mark Haines

Michael John Regan

Majid Azmoon

Donald G Harris

Dale Dean Timm, Jr

Mohammad Akhavin

Norman E Pawlowski

Keshava A Prasad

John L Stoffel, Jr

Michael E Peterschmidt

David Herbert Donovan

Ulrich E Hess

Domingo A Figueredo

Carrie E Harris

Gregory T Hindman

Pere Esterri

Richard A Sader

Harold Lee Van Nice

Robert-Scott Melendrino Lopez

Paul H Mcclelland

Alexander N Govyadinov

Zhang-Lin Zhou

Ronald Albert Askeland

Gregg A Lane

Charles E Moore

Rodney David Stramel

Hai Quang Tran

Xavier Bruch

John Paul Harmon

James P Kearns

Brett E Dahlgren

Jeffrey D Langford

Thomas Michael Sabo

Jeffrey Allen Wagner

Grant Allen Webster

Jaime H Bohorquez

Larry S Metz

Alex Andrea Tallada

Frank Drogo

Gonzalo Gaston Llado

Hanno Ix

Chandrasekhar Nadimpalli

Marian Dinares Argemi

Kai Kong Iu

Francisco Lopez Moral

James R Hulings

John P Whitlock

W Bruce Reid

Shao-Wei Li

Shailendra Kumar

Maria Dinares Argemi

Duane A Fasen

Maria Magdalena Martinez Ferrandiz

Jerome E Beckmann

David K Mc Elfresh

Daniel Vincent Keane

John H Stanback

Xavier Bruch Pla

Yit Hong Tor

Yi Hong Tor

Eldukar V Bhaskar

Barbara Parcells

Alyssa Michelle Siegman

Ronald A Askeland

Jeffrey A Wagner

Daniel V Keane

Alyssa M Siegman

An example device includes an array of sensor modules. A sensor module includes a body to be positioned in alignment with a planar target, a light source coupled to the body to emit light to the planar target along a source optical path, and a plurality of light sensors coupled to the body. Each light sensor is to sense a different wavelength of light received from the planar target along a sensor optical path. The sensor optical path is different from the source optical path. The bodies of the array of sensor modules are arranged in a planar tiling pattern with respect to a longitudinal axis of the planar target.

Modular and tiled optical sensors

Herein is disclosed a method of transfer inkjet printing comprising jetting a radiation curable inkjet ink onto an intermediate transfer member of an inkjet printer to form an image; irradiating the radiation curable inkjet ink on the intermediate transfer member to form an at least partially cured image; and transferring the at least partially cured image to a substrate to form a printed substrate. Herein is also disclosed a transfer inkjet printing apparatus adapted, in use, to perform the method.

Inkjet printing method and apparatus

A fluid injection module may include a fluid ejection die, a die carrier, a bypass fluid passage in at least one pressure regulator. The fluid ejection die may include nozzle orifices on a front face of the die, first and second fluid passages extending through the die and a microchannel extending from the first fluid passage to the second fluid passage proximate the nozzle orifices to circulate fluid from the first fluid passage to the second fluid passage. Third and fourth fluid passages may extend through the die carrier. The bypass fluid passage may extend from the third fluid passage to the fourth fluid passage while being connected to the first fluid passage and the second fluid passage. The at least one pressure regulator is to induce pressure differential driven fluid flow across the microchannel and across the bypass fluid passage.

Dual regulator print module

A print module may include a printhead die. The printhead die may include a chamber layer having ink chambers and micro-channels formed in the chamber layer. The print module may further include a die carrier including manifold passages through which ink flows to and from the printhead die and dual pressure regulators to flow fluid through the micro-channels of the printhead die.

A print module includes a printhead die, an input regulator to regulate input fluid pressure to the die, and an output regulator to regulate output fluid pressure from the die. A method includes receiving fluid at an input regulator to a print module, creating a fluid pressure differential within the print module between the input regulator and an output regulator, flowing fluid from the input regulator through a printhead die and to an output regulator using the pressure differential, and drawing fluid from the output regulator.

A printer is disclosed herein. The printer has a printhead having a plurality of ink nozzles for ejecting ink, a servicing mechanism for capturing the ejected ink from the ink nozzles, to service the printhead, and a control device coupled to the printhead and the servicing mechanism for regulating the servicing. As part of the regulation, the control device continues feeding a substrate towards the printhead during an idle period. The idle period of the printhead can be a duration when printing on the substrate is suspended. Further, the control device regulates ejection of ink from the ink nozzles towards the substrate during the idle period and operates the servicing mechanism during the idle period. In an example, the servicing mechanism captures the ink before the ink reaches the substrate.

Servicing a printhead of a printer

An ink-jet printhead is provided having a thin film substrate comprising a plurality of thin film layers; a plurality of ink firing heater resistors defined in said plurality of thin film layers; a polymer fluid barrier layer; and a carbon rich layer disposed on said plurality of thin film layers, for bonding said polymer fluid barrier layer to said thin film substrate.

Ink-jet printhead and method for producing the same

A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Substrate for fluid ejection devices

A method of forming a fluid ejection assembly includes providing a substrate including a plurality of layers and having a plurality of fluid passages extending through the plurality of layers, extending a support between opposite sides of each of the fluid passages, and mounting a plurality of fluid ejection devices on the substrate, including communicating each of the fluid ejection devices with one of the fluid passages.

Method of forming substrate with fluid passage supports

A printhead assembly includes a carrier having a first side and a second side contiguous with the first side, a plurality of printhead dies each mounted on the first side of the carrier, an electrical circuit including a first portion disposed on the first side of the carrier and a second portion disposed on the second side of the carrier, and a plurality of electrical connectors each electrically coupled to the first portion of the electrical circuit and one of the printhead dies. The electrical circuit has a plurality of openings defined in the first portion thereof such that each of the openings are sized to accommodate one of the printhead dies, and has a first side facing the carrier and a second side opposite the first side thereof such that each of the electrical connectors are electrically coupled to the second side of the electrical circuit and one of the printhead dies.

Electrical circuit for printhead assembly

A wide-array inkjet printhead assembly includes a carrier having a first side and a second side contiguous with the first side, and a plurality of printhead dies each mounted on the first side of the carrier. An electrical circuit is disposed on the first side and the second side of the carrier. As such, a plurality of electrical connectors are each electrically coupled to the electrical circuit and one of the printhead dies.

Electrical circuit for wide-array inkjet printhead assembly

A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.

Inkjet printhead assembly having planarized mounting layer for printhead dies

Growing community of inventors

La Jolla, CA, United States of America

Brian J Keefe