The United States of America As Represented by the Administrator of the

United States of America As Represented by the Administrator of Nasa

Other

The United States of America As Represented by the United States

The United States of America As Represented by the Administrator

Old Dominion University Research Foundation

Brian J Jensen

Paul M Hergenrother

Roberto J Cano

Robert G Bryant

Joel A Alexa

Stephen J Hales

Erik S Weiser

Donald Laurence Thomsen, Iii

Stephen J Havens

Robert G Bass

Juan Miguel Vazquez

Peter T Lillehei

John Brittain Cooper

Kent L Wise

Brian W Grimsley

Mark B Gruber

Tan-Hung Hou

Aspects relate to methods of building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.

Methods of making Z-shielding

Disclosed are methods of building Z-graded radiation shielding and covers. In one aspect. the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.

A method of fabricating a composite material includes utilizing a radio frequency plasma process to form a plasma plume comprising nanoparticles. The nanoparticles may comprise boron nitride nanoparticles, silicon carbide nanoparticles, beryllium oxide nanoparticles, or carbon nanoparticles. The nanoparticles may comprise nanotubes or other particles depending on the requirements of a particular application. The nanoparticles are deposited on a substrate by directing a plasma plume towards the substrate. The nanoparticles are formed in the plasma plume immediately prior to being deposited on the substrate. The nanoparticles may form a mechanical bond with the fibers in addition to a chemical bond in the absence of a catalyst. The substrate may comprise a fiber fabric that may optionally be coated with a thin layer of metal. Alternatively, the substrate may comprise a solid material such as a metal sheet or plate.

Nanoparticle hybrid composites by RF plasma spray deposition

High quality thermoplastic composites and composite laminates containing nanoparticles and/or nanofibers, and methods of producing such composites and laminates are disclosed. The composites comprise a thermoplastic polymer and a plurality of nanoparticles, and may include a fibrous structural reinforcement. The composite laminates are formed from a plurality of nanoparticle-containing composite layers and may be fused to one another via an automated process.

Methods for preparing nanoparticle-containing thermoplastic composite laminates

Methods of building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the methods include improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade from the enclosure.

A metal/fiber laminate has a plurality of adjacent layers. Each layer is porous and includes an arrangement of fibers. At least one of the layers has its fibers coated with a metal. A polymer matrix permeates each such arrangement.

Metal/fiber laminate and fabrication using a porous metal/fiber preform

A method of fabricating a metal/composite hybrid laminate is provided. One or more layered arrangements are stacked on a solid base to form a layered structure. Each layered arrangement is defined by a fibrous material and a perforated metal sheet. A resin in its liquid state is introduced along a portion of the layered structure while a differential pressure is applied across the laminate structure until the resin permeates the fibrous material of each layered arrangement and fills perforations in each perforated metal sheet. The resin is cured thereby yielding a metal/composite hybrid laminate.

Resin infusion of layered metal/composite hybrid and resulting metal/composite hybrid laminate

A fully imidized, solvent-free polyimide foam having excellent mechanical, acoustic, thermal, and flame resistant properties is produced. A first solution is provided, which includes one or more aromatic dianhydrides or derivatives of aromatic dianhydrides, and may include one or more aromatic diamines, dissolved in one or more polar solvents, along with an effective amount of one or more blowing agents. This first solution may also advantageously include effective amounts respectively of one or mores catalysts, one or more surfactants, and one or more fire retardants. A second solution is also provided which includes one or more isocyanates. The first and second solutions are rapidly and thoroughly mixed to produce an admixture, which is allowed to foam&#x2014;in an open container, or in a closed mold&#x2014;under ambient conditions to completion produce a foamed product. This foamed product is then cured by high frequency electromagnetic radiation, thermal energy, or a combination thereof. Alternatively, the process is adapted for spraying or extrusion.

Polyimide foams

A double vacuum bag molding assembly with improved void management and laminate net shape control which provides a double vacuum environment for use in fabricating composites from prepregs containing air and/or volatiles such as reactive resin matrix composites or composites from solvent containing prepregs with non-reactive resins matrices. By using two vacuum environments during the curing process, a vacuum can be drawn during a B-stage of a two-step cycle without placing the composite under significant relative pressure. During the final cure stage, a significant pressure can be applied by releasing the vacuum in one of the two environments. Inner and outer bags are useful for creating the two vacuum environments with a perforated tool intermediate the two. The composite is placed intermediate a tool plate and a caul plate in the first environment with the inner bag and tool plate defining the first environment. The second environment is characterized by the outer bag which is placed over the inner bag and the tool plate.

Double vacuum bag process for resin matrix composite manufacturing

Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of reactive endcapper. The reactive endcappers studied include but should not be limited to 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4&prime;-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride, NA). Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. By simply changing the ratio of APB to the other diamine in the polyimide backbone, a material with a unique combination of solubility, Tg, Tm, melt viscosity, toughness and elevated temperature mechanical properties can be prepared. The copolymers that result from using APB to enhance processability have a unique combination of properties that include low pressure processing (200 psi and below), long term melt stability (several hours at 300&deg; C. for the phenylethynyl terminated polymers), high toughness, improved solvent resistance, improved adhesive properties, and improved composite mechanical properties. These copolyimides are eminently suitable as adhesives, composite matrices, moldings, films and coatings.

Method to prepare processable polyimides with reactive endogroups using 1,3-bis(3-aminophenoxy)benzene

This invention is an improvement in standard polymerizations procedures, i.e., addition-type and step-growth type polymerizations, wherein momomers are reacted to form a growing polymer chain. The improvement includes employing an effective amount of a trifunctional monomer (such as a trifunctional amine, anhydride, or phenol) in the polymerization procedure to form a mixture of polymeric materials consisting of branced polymers, star-shaped polymers, and linear polymers. This mixture of polymeric materials has a lower melt temperature and a lower melt viscosity than corresponding linear polymeric materials of equivalent molecular weight.

Method of preparing polymers with low melt viscosity

Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of a non-reactive endcapper, such as phthalic anhydride. Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. Polyimides that are more rigid in nature require more APB to impart processability than polyimides that are less rigid in nature. The copolymers that result from using APB to enhance processability have a unique combination of properties including: excellent thin film properties, low pressure processing (200 psi and below), improved toughness, improved solvent resistance, improved adhesive properties, improved composite mechanical properties, long term melt stability (several hours at 390 C.), and lower melt viscosities.

Method to prepare processable polyimides with non-reactive endgroups

Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of reactive endcapper. The reactive endcappers studied include but should not be limited to 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4'-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride, NA). Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. By simply changing the ratio of APB to the other diamine in the polyimide backbone, a material with a unique combination of solubility, Tg, Tm, melt viscosity, toughness and elevated temperature mechanical properties can be prepared. The copolymers that result from using APB to enhance processability have a unique combination of properties that include low pressure processing (200 psi and below), long term melt stability (several hours at 300.degree. C. for the phenylethynyl terminated polymers), high toughness, improved solvent resistance, improved adhesive properties, and improved composite mechanical properties. These copolyimides are eminently suitable as adhesives, composite matrices, moldings, films and coatings.

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Williamsburg, VA, United States of America

Brian J Jensen