Ford Motor Company Limited

Visteon Global Technolgoies, Inc.

Brian J Hayden

Cuong Van Pham

Bethany J Walles

Paul Fredrick Luther Weindorf

Mark Stephen Topping

Michael George Todd

Robert Edward Belke, Jr

Qais Sharif

Rosa Lynda Nuno

Lawrence LeRoy Kneisel

Prathap Amerwai Reddy

Elijah Louis Auger

Paul Frederick Luther Weindorf

Adam Henry Zysnarski

Danail Krasimirov Totev

Matthew Ritthaler

Daniel Edward Farnstrom

C V Pham

Peter R Cibirka

Kong Pheng Lor

Andrew F Rice

A controller configured for minimizing power dissipation of a full area local dimming (FALD) display. The controller configured for determining an input grayscale value for each of a plurality of pixels comprising the image, remapping the input grayscale values to output grayscale values, displaying the image according to the output grayscale values, and controlling a normalized backlight luminance for each zone according to a maximum grayscale value determined therefor.

Power dissipation for full area local dimming (FALD) display

A power reduced display includes a light source having an available space and configured to generate a backlight, a first display having multiple first pixels, wherein each first pixel is configured to selectively pass and block the backlight, a second display having multiple second pixels. The light source includes a first number of first packages each having a single light-emitting diode. The first number is a largest number of the first packages that fit in the available space of the light source. The first number of the first packages is configured to consume a first power to produce a particular luminance. A second number of second packages each having two light-emitting diodes alternatively fit in the available space and is configured to consume a second power to produce the particular luminance. The first number is greater than the second number. The first power is less than the second power.

Display system

An electro-optical system includes a voltage supply device, an active polarizing layer, a retarding layer, and a reflective layer. The active polarizing layer is electrically coupled to the voltage supply device. The active polarizing layer is configured to switch back and forth between a non-polarized state and a polarized state as the voltage supply device supplies varying levels of voltage. The retarding layer is configured to alter the polarization state of light traveling through it. The reflective layer is positioned adjacent to the retarding layer.

Electro-optical reflection systems

Disclosed herein are systems, methods, and devices for detecting a polarization of eyewear worn by a viewer gazing at an electronic display. The detection disclosed herein may be employed to control and adjust the electronic display to compensate for the effects of polarization. The systems disclosed herein incorporate an embodiment with two IR sources, and an embodiment employing a single IR source coupled with electro-optical devices.

Detecting polarization of a viewer's eyewear

Disclosed herein are devices, methods and systems for implementing an electronic display with a dead-front appearance with a combination of polarizing devices. Specifically, the various permutations and combinations disclosed herein each include a linear polarizer, an active polarizer, and various combinations of linear and curved lenses, each being driven by light sourced from a backlight display.

Electronic display with multiple polarizer layers

A backlight assembly for a gauge of an automotive display panel and a method of illuminating a gauge of an automotive display panel is provided. The backlight assembly includes a lightpipe having a U-shaped configuration and a reflective dish surrounding the lightpipe. The lightpipe and the reflective dish are disposed on a mounting plate of the gauge above a liquid crystal display (LCD). Additionally, the backlight assembly includes one or more top firing light emitting diodes (LEDs) disposed adjacent to the lightpipe. The LEDs emit light to the lightpipe which in turn transmits light to the reflective dish. The reflective dish reflects back or disperses the light evenly to illuminate the graphic applique of the gauge.

Backlight assembly

A solderless method for assembling a semiconductor electronic flip-chip device to an electrical interconnecting substrate including the steps of forming a plurality of raised electrical contacts and plurality of contact pads. The pads correspond in number and physical location with the electrical contacts. The pads and contact mate when brought together. A quantity of plastic material is interposed between the electrical device and substrate. The plastic material is heated so that it softens and flows. The electronic device and substrate are urged together. The urging step displaces the molten plastic material from between the contacts and pads. The contacts and pads are jointed directly without any adhesive, solder or conducive filler therebetween to electrically interconnect the electronic device and substrate. The plastic material is allowed to cool whereby the electronic device and substrate are adhesively bonded together and electrically interconnected.

Solderless flip-chip assembly and method and material for same

A substrate and electrical connector assembly including a unitary panel structure with metal conductors having a rigid main body portion, a rigid marginal edge portion, and a thin flexible section extending between the rigid main body portion and the rigid marginal edge portion. The assembly also includes an at least one conductive lead deposited on a surface of the plastic panel structure which extends from the rigid main body portion across the flexible section to the rigid marginal edge portion. Further included is an at least one conductive terminal affixed to the rigid marginal edge portion which is in electrical connection with the at least one conductive lead. The at least one conductive terminal is adapted to receive a mating connector. The flexible section enables the rigid marginal edge portion to move relative to the rigid main body portion.

Substrate and electrical connector assembly

A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor. The members are then held together until each joint solidifies, and then the horn and/or anvil are retracted.

Method for ultrasonic bonding flexible circuits

A method of soldering materials by controlling ultrasonic energy to effect melting of only the solder in an assembly to be joined that is carried on a low temperature melting substrate. The method facilitates making electrical connections for completing an electronic circuit unit that is supported on a low temperature melting substrate and comprises (a) positioning together first and second conductive terminals for said circuit with a solder deposit therebetween to form an assembly, at least one of the terminals of such assembly being supported directly on such low temperature melting substrate; (b) gripping the assembly between an ultrasonic motion generating horn and an anvil, while exciting the horn to apply ultrasonic vibration to the first terminal to provide sufficient shearing energy that frictionally rubs at least one surface of the solder deposit in a rubbing direction generally parallel to said one surface to rapidly heat and melt the solder deposit; and (c) essentially immediately upon the completion melting of the solder deposit, ceasing the application of ultrasonic shearing energy to allow the solder to solidify and form a soldered diffusion joint between the terminals.

Method of soldering materials supported on low-melting substrates

In a method for reversible assembly of a semiconductor electronic flip-chip device to an electrical interconnecting substrate, a filled thermoplastic adhesive is interposed between an active face of the flip-chip device and a bond site on the substrate. Electrical connection is established between the flip-chip device and the substrate and, generally simultaneously, adhesive bonding between them is established via viscous flow of the filled thermoplastic adhesive above its glass transition temperature, followed by cooling of the adhesive. The adhesive can be reheated to free the flip-chip device of its adhesive bond to the substrate. The filled thermoplastic adhesive includes a low expansion filler in a binder matrix. In accordance with one aspect of the invention, the binder matrix is poly(aryl ether ketone) having the chemical formula ##STR1## where n is from 5 to 150 and R is selected from suitable divalent moieties. The filled thermoplastic adhesive can be interposed between the flip-chip device and the substrate as a preform or by other suitable method, such as syringe extrusion in a molten or viscous state.

Repairable flip-chip undercoating assembly and method and material for

An ultrasonic wirebonder has a horn and a transducer for vibrating the horn at a predetermined frequency. A magnet affixed to the horn generates a magnetic field. A coil coupled to the magnet has an output signal induced from the magnetic field moving relative to said coil. A filtering means filters the output signal from the coil to determine the reliably of the ultrasonic bond. An output device is used to monitor the output signal and determine whether the bond is reliable.

Magnetic energy monitor for an ultrasonic wirebonder

A process for bonding a flip chip (20), of the type having an active face provided with conductive bumps, to a substrate (22) so that its active face is oriented toward the substrate (22). The flip chip (20) is coupled through a vacuum to the distended end (32) of an ultrasonic horn (30) and then lowered onto the substrate (22) so that the bumps (20b) align with a bonding pattern on the substrate (22). A bias force is applied through the ultrasonic horn (30) to the backside of the flip chip (20), in a direction normal to the substrate (22) so that minimal lateral displacement of the flip chip (20) and the substrate (22) results. The ultrasonic horn (30) is then activated while the bias force is applied such that the ultrasonic energy is isothermally transferred in a direction normal to and across the flip chip (20) to the substrate (22) for creating a diffusion bond therebetween.

Ultrasonic flip chip bonding process and apparatus

An apparatus for testing an integrated circuit includes a bond substrate having a location for an integrated circuit. The location on the bond substrate has a plurality of traces around each location. A first fixture holds the bond substrate in a fixed relation to first fixture and holds the integrated circuit in a fixed relation to the first fixture and the bond substrate. A wirebonder forms wirebonds between the traces and the bond pads. An electrical tester provides electrical signals from the traces to the bond pads to verifying the operation of the integrated circuit. A second fixture lifts the bond substrate while the integrated circuit remains held to the first fixture. A vibrator vibrates the first fixture in relation to the second fixture so that the wirebonds are broken at a predetermined location near the bond pad.

Growing community of inventors

Royal Oak, MI, United States of America

Brian J Hayden