National Semiconductor Corporation

Brian Huss

William Paul Mazotti

Luu Thanh Nguyen

Peter Deane

Jia Liu

Haryanto Chandra

Todd Thyes

Glenn Woodhouse

John Rukavina

Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.

Optical sub-assembly packaging techniques that incorporate optical lenses

An apparatus opto-electronic module that is flexible in design such that components of different types and dimensions can be incorporated into the module without straying from certain mechanical standards requirements is described. Generally, an opto-electronic module of the present invention includes a first substrate that supports an opto-electronic device and thereby the optical port, a second substrate that includes the electrical port, and a flexible connector that electrically connects the first and second substrates. The flexible connector allows for the first substrate and the second substrate to be positioned in various orientations with respect to each other so that optical and electrical components of various sizes can be utilized and still remain in compliance with a set of mechanical standards.

Opto-electronic module form factor having adjustable optical plane height

A plug device for use during manufacturing and/or testing processes for optoelectronic (OE) devices is described. The plug device has a handle and structures that extend off of the handle to cover 'barrels' of an OE device. The plug device prevents contaminating particulates from reacting the lenses and/or the photonic devices within the OE device. The plug device can also be made of a material that transmits light signals so that testing of the OE devices can be easily performed. The plug device can also have a surface to which a pick and place machine can attach itself so that the plug device and a respective optoelectronic device can be easily transported. Overall, the plug device can simplify both the manufacturing and testing processes for OE devices.

Multi-purpose optical light pipe

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Appleton, WI, United States of America

Brian Huss