Ametek, Inc.

Abaco Systems, Inc.

Brian Hoden

Joo Han Kim

Jonathan Anderson

Joo-Han Kim

Peter Kortekaas

Lucius Akalanne

James Sweeney

A cooling module comprising a porous media that is at least partially inserted into a coolant channel of a heatsink. Generally the coolant is a liquid, though in some instances it may be a gas. More specific, a cooling module for providing enhanced localized cooling of a heatsink comprising a porous media having a volume and a seal plate connected to the porous media, wherein a portion of the volume of the porous media extends through a wall and/or a heatframe of the heatsink into a coolant channel such that coolant flows through the porous media extending into the coolant channel. The seal plate provides a seal for the wall and/or the heatframe so that the coolant does not flow out the wall and/or the heatframe. The seal plate provides enhanced localized cooling to a heat producing device that is at least in partial contact with the seal plate.

Cooling module for providing enhanced localized cooling of a heatsink

A circuit card assembly comprising at least one electronic component that generates heat and a thermal management system the at least one electronic component is disclosed. The thermal management system comprises one or more phase change modules for distributing and storing heat; a metal frame in thermal contact with the at least one electronic component and having at least one opening for receiving the one or more phase change modules; and a heat transfer apparatus in thermal contact with one or more of the at least one electronic component and the metal frame. The heat transfer apparatus comprises at least one heat pipe and/or at least one heat spreader. The heat transfer apparatus provides a first heat transfer path during a period of reduced heat dissipation or cooling. The one or more phase change modules distributes and stores heat during the period of reduced heat dissipation or cooling.

Circuit card assemblies

An electronic assembly having a multi-slot card assembly and a chassis is provided. The chassis has two or more chassis mounting slots, each including three walls. The multi-slot card assembly is mountable into the chassis and has two or more protrusions. The card assembly comprises at least one heat frame, at least one circuit card module mounted to the at least one heat frame, and at least one expandable fastener. When the card assembly is mounted into the chassis and the at least one fastener is expanded, the at least one fastener applies force against both of one of the walls of the slot and a surface of the at least one heat frame.

Conduction cooled chassis

An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.

Growing community of inventors

Albuquerque, NM, United States of America

Brian Hoden