Pragmatic Printing Limited

Pragmatic Semiconductor Limited

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno

Imec Vzw

Brian Hardy Cobb

Richard John Price

Richard Price

Feras Alkhalil

Scott Darren White

Catherine Ramsdale

Joao De Oliveira

Neil Davies

Stephen Devenport

Thomas Clark

Jan Genoe

Ken Williamson

Anthony Sou

Kenneth David Williamson

Pascaline Boulanger

Gillian Ewers

Rob Mann

A Schottky diode comprises: a first electrode; a second electrode; and a body of semiconductive material connected to the first electrode at a first interface and connected to the second electrode at a second interface, wherein the first interface comprises a first planar region lying in a first plane and the first electrode has a first projection onto the first plane in a first direction normal to the first plane, the second interface comprises a second planar region lying in a second plane and the second electrode has a second projection onto the first plane in said first direction, at least a portion of the second projection lies outside the first projection, said second planar region is offset from the first planar region in said first direction, and one of the first interface and the second interface provides a Schottky contact.

Schottky diode

An electronic circuit comprises a first resistor () and a second resistor (). The first resistor comprises: a first sheet () of resistive material; and a first pair () of conductive contacts, each arranged in electrical contact with the first sheet, and arranged such that a shortest resistive path in the first sheet between the first pair of contacts passes through the first sheet and has a length equal to a thickness (LI) of the first sheet. The second resistor comprises: a second sheet () of resistive material; and a second pair () of conductive contacts, each arranged in electrical contact with the second sheet, and arranged such that a shortest resistive path (L) in the second sheet between the second pair of contacts passes along at least a portion of a length of the second sheet.

Electronic circuits and their methods of manufacture

There is provided a flexible electronic structure for bonding with an external circuit, comprising a flexible substrate, having a first surface, configured for bonding with the external circuit, and an opposing second surface, configured for engagement with a bonding tool, comprising at least one electronic component; at least one contact member, operatively coupled with said at least one electronic component and provided at said first surface of said flexible substrate, and adapted to operably interface with the external circuit after bonding, and at least one shield member, provided at said first surface so as to shieldingly overlap at least a portion of said at least one electronic component, adapted to withstand a predetermined pressure applied to said first surface and/or said opposing second surface during bonding with the external circuit.

Flexible electronic structure

There is provided a flexible electronic structure for bonding with an external circuit. The flexible electronic structure comprising: a flexible body having a first surface, the flexible body comprising at least one electronic component; at least one contact element configured to bond with the external circuit, the at least one contact element operatively coupled with the at least one electronic component and provided at the first surface of the flexible body, and arranged to operably interface with the external circuit after bonding, and at least one support element provided at the first surface of the flexible body, each support element arranged to contact a corresponding surface element disposed on a first surface of an external structure comprising the external circuit.

Flexible electronic structure including a support element

An interposer subassembly that is suitable for an electronic system having at least one integrated circuit (1C) component. The interposer subassembly includes a flexible base layer, having a first surface and an opposing second surface, at least one active electronic circuit component, operatively integrated within the flexible base layer, and at least one first patterned contact layer, provided on any one of the first surface and the second surface of the flexible base layer and which is configured to operably interface with the at least one active electronic circuit component and the at least one 1C component.

Flexible interposer

A structure is disclosed, comprising: a first field effect transistor, FET, comprising a first source terminal, a first drain terminal, a first layer or body of semiconductive material arranged to provide a first semiconductive channel connecting the first source terminal to the first drain terminal, and a gate terminal arranged with respect to the first semiconductive channel such that a conductivity of the first semiconductive channel may be controlled by application of a voltage to the gate terminal; and a second FET comprising a second source terminal, a second drain terminal, a second layer or body of semiconductive material arranged to provide a second semiconductive channel connecting the second source terminal to the second drain terminal, and the gate terminal, the second conductive channel being arranged with respect to the gate terminal such that a conductivity of the second channel may be controlled by application of a voltage to the gate terminal. Methods of manufacturing such structures are also disclosed.

Methods of manufacturing electronic structures

The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.

Integrated circuit on flexible substrate manufacturing process

An electronic circuit is described, comprising: a first power rail; a second power rail; and a field effect transistor, FET, the FET comprising: a first terminal coupled directly or indirectly to the first power rail; a second terminal coupled directly or indirectly to the second power rail; a channel of semiconductive material connecting the first terminal to the second terminal; a gate terminal to which a voltage may be applied to control a conductivity of the channel, the channel providing a conduction path from the first terminal to the second terminal; and a gate dielectric arranged to insulate the gate terminal from the channel. The circuit further comprises a layer or other body of dielectric material, the gate dielectric being a first portion of the layer or other body of dielectric material. The first power rail comprises a first rail portion arranged on a first side of a second portion of the layer or other body of dielectric material, and the second power rail comprises a second rail portion arranged on a second side of the second portion of the layer or other body of dielectric material, the second side being opposite the first side. The second portion of the layer or other body of dielectric material separates the first and second rail portions and with the first and second rail portions provides a capacitance to the circuit.

Electronic circuit to generate a DC voltage from a wireless signal and method of manufacture

Measurement apparatus, for generating a first output signal indicative of a measurand, comprises: a first oscillator circuit and a second oscillator circuit, each oscillator circuit being arranged to generate a respective oscillating output signal and comprising at least a respective first component having a property determining a respective output frequency of the respective oscillating output signal; a sensor for sensing said measurand, the sensor comprising said first component of the first oscillator circuit, said property of said first component of the first oscillator circuit being dependent upon said measurand; and circuitry arranged to receive said oscillating output signals and generate said first output signal, said first output signal being indicative of a number of cycles of one of the first and second oscillating output signals in a time period determined by a period of the other of said first and second oscillating output signals.

Measurement apparatus

Electronic structure having two field effect transistors

The present invention provides for a RFID tag assembly that is suitable for operation with at least one RFID reader assembly. The RFID tag assembly comprises, inter alia, an antenna member for transmitting and/or receiving an RFID signal, and at least one integrated circuit (IC) for processing the RFID signal and which is configured to communicate, alternatingly and sequentially in time, a first signal transmission and at least one second signal transmission, each defined by a plurality of predetermined signal transmission parameters, to the at least one RFI D reader assembly, utilising time-division multiplexing, wherein the at least one first signal transmission differs from the at least one second signal transmission in at least one of said plurality of predetermined signal transmission parameters.

Multi-protocol RFID tag and system

A method, apparatus and system for secure one-way RFID tag identification is provided. The method comprising generating, at an RFID tag, an auxiliary identifier; generating, at an RFID tag, a secure representation based on the auxiliary identifier; transmitting, from the RFID tag and receiving at an RFID reader, one or more representations of the auxiliary identifier and the tag identifier including the secure representation; and verifying the identity of the RFID tag based on the received representations.

Secure RFID tag identification

One exemplary aspect relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations to facilitate shipping and subsequent removal of the flexible substrate from the carrier. The process includes providing a flexible substrate comprising a plurality of integrated circuits thereon providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier. The process further includes changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.

Multi-step integrated circuit handling process and apparatus

A method, apparatus and system for secure one-way RFID tag identifications provided. The method comprising generating, at an RFID tag, an auxiliary identifier; generating, at an RFID tag, a secure representation based on the auxiliary identifier; transmitting, from the RFID tag and receiving at an RFID reader, one or more representations of the auxiliary identifier and the tag identifier including the secure representation; and verifying the identity of the RFID tag based on the received representations.

Growing community of inventors

Cambridge, United Kingdom

Brian Hardy Cobb