Digital Optics Corporation

Digitaloptics Corporation East

Brian Harden

Michael R Feldman

Alan D Kathman

W Hudson Welch

Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby

An integrated optical imaging system includes a first substrate having first and second opposing surfaces, a second substrate having third and fourth opposing surfaces, a spacer between a substantially planar portion of the third surface of the second substrate and a substantially planar portion of the second surface of the first substrate, at least two of the spacer, the first substrate and the second substrate sealing an interior space between the third surface of the second substrate and the second surface of the first substrate, and an optical imaging system having n surfaces, where n is greater than or equal to two, at least two of the n surfaces of the optical imaging system are on respective ones of the first, second, third and fourth surfaces.

Integrated optical imaging systems including an interior space between opposing substrates and associated methods

Wafer level creation of multiple optical elements

Method of dicing wafer level integrated multiple optical elements

Growing community of inventors

Charlotte, NC, United States of America

Brian Harden