Johnstech International Corporation

Brian Halvorson

Jathan D Edwards

Charles Marks

Jeffrey C Sherry

Michael W Andres

John DeBauche

Dan Campion

Steve Rott

Brian Eshult

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.

Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin () are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide () is maintained in alignment with the retainerby establishing a registration corner () and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

Wafer level integrated circuit probe array and method of construction

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin () are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (). The elastomer is precompressed from its natural rest state between a top () plate and a bottom (). Pre compression improves the resilient response of the pins. The pin crowns () are maintained relatively coplanar by the engagement of at least one flange (-) against an up-stop surfaceof plate, thereby insuring coplanarity of the crowns. The pin guide () is maintained in alignment with the retainerby establishing a registration corner () and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

Wafer level integrated circuit contactor and method of construction

The test system provides an array of test probes having a cross beam. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. The probes are biased upwardly through the retainer by an elastomeric block having a similar array of slots. The elastomer is then capped at its bottom by a second or lower retainer with like slots to form a sandwich with the elastomer therebetween. The bottom ends of the probes are group by probe height. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and take continue the circuits to a probe card where test signals originate.

Testing apparatus and method for microcircuit and wafer level IC testing

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin () are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (). The elastomer is precompressed from its natural rest state between a top () plate and a bottom (). Pre compression improves the resilient response of the pins. The pin crows () are maintained relatively coplanar by the engagement of at least one flang (-) against an up-stop surfaceof plate, thereby insuring coplanarity of the crowns. The pin guide () is maintained in alignment with the retainerby establishing a registration corner () and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

Growing community of inventors

Saint Paul, MN, United States of America

Brian Halvorson