Maxim Integrated Products, Inc.

Brian Gregory Rush

Feng Yu

Ken Wang

Tian Tian

Douglas Edward Heineman

Siwas Chandhrasri

Kevin Bryan LaVoie

Ming Cheng

Mohammad Ayyash

Tuyen Pham

Systems and methods increase power efficiency in communication systems by examining a digital signal to determine whether a threshold corresponding to an increase in a power requirement is likely to be exceeded. The signal is encoded with information indicating the likely change and communicated to a driver that, upon extracting the information, uses it to cause instruct an amplifier to increase a power output to accommodate the increase in power requirement. Once the threshold is no longer exceeded, the driver circuit, advantageously, decreases the power output to conserve energy. In various embodiments, an amplifier may increase power efficiency by switching from a low-power circuit configuration to a high-circuit configuration.

Systems and methods for controlling powerstage supply modulation via audio interface

A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.

Silicon shield for package stress sensitive devices

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Southlake, TX, United States of America

Brian Gregory Rush