Hewlett-packard Development Company, L.p.

Yakima Products, Inc.

Yakima Innovation Development Corporation

Brian F Davis

Aaron J Foley

Dominic M D'Andrea

Samuel Martin Babb

Paul Howard Mazurkiewicz

Kristina Lynn Mann

Lowell Edward Kolb

Jonathan P Mankin

Marvin Wahlen

Kevin Lo

Kevin E Lesley

A printer paper tray comprising a paper tray bezel, and a paper tray cassette coupled to the paper tray bezel, in which the paper tray bezel moves in the x and y direction independent of the paper tray cassette. A printer comprising a paper tray comprising a bezel coupled to a cassette in which the bezel moves independent of the cassette and is biased towards the cassette in the x direction. A bezel mounting system comprising a number of biasing members to bias a printer tray bezel towards a printer tray cassette in the x-direction, and a number of biasing pads to bias the bezel in a substantially centered position with respect to the cassette.

Printer paper tray

A bike mount for securing a bike on a vehicle includes a wheel clamp and securing devices for mounting bikes of various types, dimensions, and styles in one or more tray portions, extending between a pair of crossbars or other support structures.

Adjustable bicycle wheel retainer

An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions. A high viscosity, non-electrically-conductive filler material is applied to printed circuit board regions that have surfaces that are cavitatious and/or which have a highly variable slope.

Method for manufacturing a printed circuit board having conformal EMI shield

Wheel gripping bicycle carrier

Fork mount bicycle carrier

An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.

EMI shield that adheres to and conforms with printed circuit board surfaces

An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions. A high viscosity, non-electrically-conductive filler material is applied to printed circuit board regions that have surfaces that are cavitatious and/or which have a highly variable slope. The filler material can be used in conjunction with conformal EMI shield board level coating. The high viscosity, electrically non-conductive filler material substantially covers each cavity such that the covered cavity is inaccessible and that the covered region of the printed circuit board has a contiguous, contoured surface. A pre-manufactured non-electrically-conductive component cover can be mounted over a corresponding component and secured to the printed wiring board. The component cover and printed wiring board surround the component, forming a sealed enclosure. The component cover has a thin cross-section and an interior surface that follows closely the surface of the component. This minimizes the volume enclosed by the component cover. In addition, the exterior surface of the component cover has a low profile, and prevents the conformal EMI shield from physically contacting the covered component. Instead, the exterior surface of the component cover is coated with the EMI shield.

Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces

Growing community of inventors

Portland, OR, United States of America

Brian F Davis