3m Innovative Properties Company

Brian E Schreiber

Joel Arthur Gerber

Joshua W Smith

Yu Chen

William Blake Kolb

Mikhail L Pekurovsky

James N Dobbs

Shawn C Dodds

Graham M Clarke

Michele A Craton

Matthew R D Smith

Keith R Bruesewitz

Adam W Kiefer

Matthew R Smith

Methods and apparatuses for applying liquid coatings are provided. A first roll (), a second roll (), and a nip () formed between the first and second rolls are provided. A coating liquid () is supplied to the nip. The coating liquid is smoothed, via the nip, into a substantially uniform layer () of liquid coating which is transferred to a substrate (). The second roll () includes a thin metal shell () and a resilient layer (), the thin metal shell encases the resilient layer therebeneath, and the thin metal shell is capable of deflecting in unison with the resilient layer such that the thin metal shell is elastically deformable at the nip when in contact with the first roll ().

Liquid coating method and apparatus with a deformable metal roll

A method of web cleaning, particularly relatively soft polymeric webs, without using dipping baths or ultrasonic energy. The method includes conveying the web against a backup roller and spraying the web with a high pressure liquid while the web is supported by the backup roller. Thereafter, residual fluid from the high pressure stream is stripped from the web by a gas curtain while the web is supported by the backup roller. In many convenient embodiments, the web is contacted with a cleaning roller while the web is in contact with the backup roller.

Apparatus and method for cleaning flexible webs

Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with conductor thereon and an electrically conducting member or bump, protruding from the conductor, that provide a shape to one surface of the precursor circuit element. A second insulating layer, including an adhesive, is placed onto the precursor circuit element and assumes the shape of the aforementioned surface of the precursor circuit element. A portion of the insulating layer is removed proximate the apex of the bump to expose at least a portion of the bump, for a sufficient electrical connection with a subsequent circuit element, while maintaining a sufficient amount of the insulating layer on the first initiating layer and bump to facilitate the mechanical connection (bond) between this resultant circuit element and a second circuit element, that may or may not have been produced by the method of the present invention.

Circuit elements using z-axis interconnect

Method for making circuit elements for a z-axis interconnect

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Oakdale, MN, United States of America

Brian E Schreiber