International Business Machines Corporation

Tel Epion Corporation

Brian Douglas Pfeifer

William C Leipold

Daniel Nelson Maynard

Noel Russell

Joshua LaRose

David C Reynolds

Mitchell R DeHond

Reginald B Wilcox, Jr

Vincent Lagana-Gizzo

Olivier Verscheure

Deepak Srinivas Turaga

Rosemary A Previti-Kelly

Timothy Charles Krywanczyk

Lisa Amini

Bette L Bergman Reuter

Justin Wai-chow Wong

Jose L Cruz

Edward Sumner Begle

Amye L Wells

Gerett Raybourn Yocum

Chad R Binkerd

Patricia Schink

Betty L Bergman Reuter

A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data.

Hybrid corrective processing system and method

A technique for analyzing two or more data streams respectively generated from two or more components of a controllable process includes the following steps. In a first step, a statistical analysis is performed on each of the two or more data streams to generate first analysis results in the form of respective statistical results for the two or more data streams. In a second step, at least a portion of the statistical results from at least one of the two or more data streams is combined with at least a portion of the statistical results from at least another one of the two or more data streams to yield second analysis results. The controllable process is adjustable based on at least one of the first analysis results and the second analysis results.

Hierarchical and incremental multivariate analysis for process control

A system, method and media for locating and defining process sensitive sites isolated to specific geometries or shape configurations within chip design data. Once a systemic process sensitive site is identified, a 3D design checking deck is coded and executed through a design checker on physical design data. Target match shapes are produced and embedded back into the design data. Pictures, maps and coordinates of process sensitive sites are produced and sent to a website library for reference.

Physical design characterization system

The present invention provides a method of preventing the build-up of polishing material within low areas of a substrate during polishing. Following the blanket deposition of a first layer, a selectively removable material is deposited over the first layer, wherein the selectively removable material fills the low areas. A surface of the substrate is polished removing the excess first layer and selectively removable material from the surface, leaving the first layer and selectively removable material within the low area. Following polishing, the selectively removable material is removed from the low areas prior to the deposition of a second layer.

Prevention of slurry build-up within wafer topography during polishing

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Lagrangeville, NY, United States of America

Brian Douglas Pfeifer