Texas Instruments Corporation

Brian David Johnson

Roberto Giampiero Massolini

Martijn Fridus Snoeij

Mikhail Valeryevich Ivanov

James Lee Todsen

Binling Zhou

A device includes a first metal layer including a first terminal outside the first coil and a second terminal within the inner area of the first coil. A second metal layer has a second coil. The second coil has a first terminal outside the second coil and a second terminal within its inner area. A first via electrically couples the second terminals of the first and second coils. A third metal layer has a third coil defining an inner area which at least partially overlaps the inner areas of the first and second coil. The third coil has a first terminal outside the third coil and a second terminal within its inner area. The second coil at least partially overlaps the third coil. A second via electrically couples together the first terminal of the second coil and the second terminal of the third coil.

Multi-layer inductor

In at least some embodiments, a system comprises a frequency generator configured to generate a second clock signal having a second frequency using a first clock signal having a first frequency. The second frequency is offset from the first frequency and each of a plurality of harmonic frequencies of the second frequency is offset from a harmonic frequency of the first frequency. The system also includes a power converter configured to produce a power signal that at least partially corresponds to the second frequency. The system further comprises an analog-to-digital converter (ADC) configured to sample and convert analog voltages at the first frequency. The ADC is powered by the power signal.

Frequency management for interference reduction of A/D converters powered by switching power converters

A bottom die and a top die stacked on the bottom die are configured to provide a daisy chain function. Both die include an input/output function control bonding pad (G), a first bonding pad (C) controllable to function as either an input or an output, and a second bonding pad (E) controllable to function as either an output or an electrically floating pad in response to a corresponding input/output function control signal. The top die () is stacked on the bottom die () and the first bonding pad (C) of the bottom die () is wire bonded to the first bonding pad (C) of the top die (). A first reference voltage (VDD) on the function control bonding pad of the bottom die configures its first bonding pad as an output and its second bonding pad as electrically floating, and a second reference voltage (VSS) on the function control bonding pad of the top die configures its first bonding pad as an input and its second bonding pad as an output, to thereby provide the daisy chain function.

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Tucson, AZ, United States of America

Brian David Johnson