High Connection Density Inc.

C Speed Corporation

Brian David Harry

Che-Yu Li

Justin Ralph Louise

Kevin Roy Francis

David A Lysack

Bryan Thomas Shepardson

John J Kresse

A system having an acquisition device for acquiring test and measurement data and providing such data to a computer system for display of such data. For each input data signal, the acquisition device has two differential receivers of opposite polarity each having an output coupled to the input of different ones of two pairs of registers, resulting in four registers sampling the input data signal periodically at four different times in accordance with two clocking signals of different phase (phase shifted 90&#xb0;) to provide a sampling rate four times the rate of the clocking signals. The resulting sample data is stored in memory of the acquisition device along with downsampled data representing a compressed, low resolution, version of the sample data which records toggling in the sample data notwithstanding such downsampling. The computer system can request readout of stored sample data and/or downsampled data during or after acquisition of sample data and downsampled data. The acquisition device preferably utilizes an FPGA to provide sampling, storage and readout of data stored in memory of the device. The FPGA may be reconfigurable in response to the computer system to provide one of different data acquiring modes selectable by a user.

Data acquisition system for test and measurement signals

The present invention is a cost effective module that provides high performance, high density and highly reliability interconnections needed between the various circuit devices that form a functional system or a part of a larger system. It includes circuit members having high speed, impedance-controlled transmission line signal paths, short land grid array interconnections between circuit members and, optionally, driver line terminators built into one of the circuit members, for maintaining high electrical performance. Suitable applications include mainframe computers, workstations, telecommunications networks, or other electronic equipment. The circuit members may be formed on conventional printed circuit cards with unpacked or packed circuit devices attached directly to the circuit members. Thermal control structures may be included to maintain the circuit devices within a reliable range of operating temperatures. A clamp is also included.

High I/O stacked modules for integrated circuits

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Baldwinsville, NY, United States of America

Brian David Harry