Dell Products Inc.

Emc IP Holding Company LLC

Emc Corporation

Brian Daniel Kennedy

Stephen Edward Strickland

Ryan Cartland McDaniel

Antonio Fontes

William F Baxter

Brian Arsenault

Nicholas Anthony Esposito

Maxwell Brooks Rapier

In one or more embodiments, one or more systems, one or more methods, and/or one or more processes may receive first data from a first device via a first two-wire interface (TWI) bus; provide the first data to a second device via a second TWI bus; receive a first arbitration request via an out of band arbitration process from a third device; provide first control information via an in band arbitration process to the first device via the first TWI bus; receive second data from an isolation device via a third TWI bus; provide the second data to the second device via the second TWI bus; receive a second arbitration request via the in band arbitration process from the first device via the first TWI bus; and provide second control information via the out of band arbitration process to the third device.

System and method of arbitrating serial buses of information handling systems

Systems and methods are disclosed that may include identifying a first coefficient of thermal expansion for a first component, the first component including component pins having a first pitch value; identifying a second coefficient of thermal expansion for a second component, the second component associated with electrically conductive pads; determining a relative expansion value based on the first coefficient of thermal expansion and the second coefficient of thermal expansion; determining a change in temperature value of the first component and the second component, the change in temperature value indicating a change in temperature caused by a soldering process; and determining a second pitch value for the electrically conductive pads based on a product of the relative expansion value, the first pitch value, and the change in temperature value, the second pitch value causing an alignment between the component pins and the electrically conductive pads during the soldering process.

System and method for compensating for thermal expansion caused by soldering process

A mid-plane assembly includes a main circuit board portion including a plurality of electrical connectors configured to releasably engage a plurality of devices, a first circuit board portion, and a first electrical coupling assembly configured to electrically couple the first circuit board portion to the main circuit board portion and position the first circuit board portion essentially orthogonal to the main circuit board portion.

Circuit board assembly

A data storage system having a plurality of disk drive sections, each one of the disk drive sections having a plurality of disk drives. Each one of a plurality of secondary SAS expanders is coupled to a corresponding one of the disk drive sections. Each one of the secondary SAS expanders has: (1) a plurality of first ports each one being connected to a corresponding one of the disk drives in the corresponding one of the plurality of disk drive sections coupled thereto; and (2) a second port. A main SAS expander has: (1) a first port; and (2) N second ports, each one of the N second ports of the main expander being connected to the second port of a corresponding one of the plurality of N secondary expanders. A storage processor is coupled to the second port of the main SAS expander.

Expandable data storage system

A chassis having a cover moveable between open and closed positions and circuitry for detecting whether the cover is in the open or the closed position. The circuitry includes a transmitter of optical energy disposed at a fixed position within the chassis for transmitting pulses of optical energy at a predetermined frequency and a receiver for optical energy disposed at a fixed position within the chassis. A reflector is mounted to an inner surface of the cover and is disposed in a path to intercept and then reflect the intercepted transmitted energy to the receiver when the cover is moved to the closed position and being disposed away from the path to prevent the transmitted energy to be intercepted and then reflected to the receiver when the cover is moved to the open position. The detection circuitry indicates whether the cover is in either the open or the closed position selectively in accordance with whether the transmitted energy is reflected to the receiver is above or below a predetermined threshold level and whether at said predetermined frequency.

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Rutland, MA, United States of America

Brian Daniel Kennedy