Spansion Llc.

Brian D White

William S Brennan

Allen Lewis Evans

Joseph William Wiseman

Bryon K Hance

Devices and systems for insulating integrated circuits from ultraviolet ('UV') light are described. The device includes a conductive feature, a first and second UV blocking layer, a first and second insulating laver, and a conductive structure. The first insulating layer overlays the first UV blocking layer. A via opening extends through the first insulating layer and the first UV blocking layer. The second UV blocking layer overlays the first insulating laver. The second insulating layer overlays the second UV blocking layer. An interconnect trench is defined in the second insulating layer and second UV blocking layer. The conductive structure is electrically connected to the conductive feature and extends into the via opening and along the interconnect trench.

Electronic devices with ultraviolet blocking layers

A process of forming an electronic device including forming a first ultraviolet ('UV') blocking layer over a conductive feature, wherein the first UV blocking layer lies within 90 nm of the conductive structure; forming a first insulating layer over the first UV blocking layer; and patterning the first insulating layer and the first UV blocking layer to form a first opening extending to the conductive feature, wherein during the process, the first UV blocking layer is exposed to UV radiation.

Growing community of inventors

Kyle, TX, United States of America

Brian D White