Rf Micro Devices, Inc.

Qorvo Us, Inc.

Brian D Sawyer

Thomas Scott Morris

Milind Shah

Donald Joseph Leahy

Ulrik Riis Madsen

Stephen Craig Parker

David Jon Hiner

David Halchin

David Jandzinski

John Robert Siomkos

Dan Carey

Waite R Warren, Jr

Brian Howard Calhoun

Mark Charles Held

Mark Alan Crandall

Carl Hinshaw

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Electronic modules having grounded electromagnetic shields

Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.

Compartmentalized shielding of selected components

Method of manufacturing an electronic module

The present invention relates to a multi-layer laminate or substrate manufacturing process for forming soldering surfaces on a substrate of a module without requiring a solder mask. In one embodiment, a substrate is provided having a substrate body, soldering pads, and a metal segment. A patterned mask is formed over the substrate such that soldering surfaces of the soldering pads remain exposed. The soldering surfaces of the soldering pads are plated to create plated soldering surfaces over the soldering pads. The plated soldering surfaces are the regions for solder placement. The patterned mask is then removed from the substrate. Next, an anti-wetting treatment is applied to the substrate such that any unplated metal surfaces react to the anti-wetting treatment to form treated surfaces. As such, the plated soldering surfaces will wet solder while the treated surface will not wet solder. In a preferred embodiment, the anti-wetting treatment is an oxidation process.

Forming soldering surfaces without requiring a solder mask

A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Conformal shielding employing segment buildup

A method for making a dual sided electronic module. A substrate has a first surface that is substantially parallel to a second surface. The second surface forms a cavity extending into an interior portion of the substrate. The substrate has at least one through hole connecting the cavity to the first surface. A first component is mounted with respect to the first surface, and a second component is mounted at least partially within the cavity. An encapsulant is applied to the first surface and through the at least one through hole into the cavity about the second component.

Dual sided electronic module

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Menlo Park, CA, United States of America

Brian D Sawyer