Hewlett-packard Development Company, L.p.

Brian D Homeijer

Robert Newton Bicknell

James McKinnell

Robert G Walmsley

Adel Jilani

Melinda M Valencia

Dennis M Lazaroff

Jennifer Wu

Rodney L Alley

Sara Jensen Homeijer

James Mckinnell

A micro electromechanical systems (MEMS) sensor is excited. The response of the MEMS sensor is measured. The MEMS sensor is calibrated.

Calibration of MEMS sensor

An acceleration-sensing device having error correction includes a stator having at least one conductor affixed to a surface and a proof mass having a first conductor affixed at a first location relative to the at least one conductor affixed to a surface of the stator. The proof mass includes a second conductor affixed at a second location relative to the at least one conductor affixed to a surface of the stator, wherein an excitation signal applied to the first conductor of the proof mass brings about a force on the proof mass in the plane of motion of the proof mass that is substantially equally opposed by a force resulting from an excitation signal applied to the second conductor of the proof mass in the plane of motion of the proof mass.

Error correction in acceleration-sensing devices

The micro-mechanical device includes a substrate with an internal cavity, a first surface, and an opposing second surface. A first trench is formed from the first surface of the substrate into the internal cavity. The first trench at least partially defines flexures. A second trench is formed from the second surface of the substrate into the internal cavity and at least partially defines a suspended mass. The suspended mass is connected by the flexures to the substrate.

Suspended masses in micro-mechanical devices

The present disclosure includes methods of forming capacitive sensors. One method includes forming a first electrode array of the capacitive sensor on a first structure. Forming the first electrode array can include: forming a dielectric material on a substrate material; forming an electrode material on the dielectric material; removing portions of the electrode material to form a number of electrodes separated from each other; and removing at least a portion of the dielectric material from between the number of electrodes. The method can include bonding the first structure to a second structure having a second electrode array of the capacitive sensor formed thereon such that the number of electrodes of the first electrode array face a number of electrodes of the second electrode array.

Methods of forming capacitive sensors

Acoustic transducer means are provided. A monolithic semiconductor layer defines a plate, a pair of oppositely disposed torsional hinges, a flexible extension and at least a portion of a support structure. Acoustic pressure communicated to the plate results in tensile strain of the flexible extension. The flexible extension provides a varying electrical characteristic responsive to the tensile strain. An electric signal corresponding to the acoustic pressure can be derived from the varying electrical characteristic of the flexible extension.

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Corvallis, OR, United States of America

Brian D Homeijer