International Business Machines Corporation

Brian D Chapman

Wai Mon Ma

James J Petrone

John P Weir

Arden Steuart Lake

Mary Ann Emmett

Nandu N Ranadive

Wai Mon Wa

Michael Variano

Roger Lam

Todd H Buley

An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.

Selective rework apparatus for surface mount components

An apparatus and method for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.

Selective rework process and apparatus for surface mount components

An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.

Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components

This invention relates to electrically connecting a first electronic component to a second electronic component wherein at least one of the electronic components must undergo modifications or repair when, for example, there is a floating signal generated from the first electronic component which can cause problems in operation of the electronic component assembly. For this type assembly an opening is provided in the second electronic component proximate the site or sites to be electrically connected to the first electronic component, which opening extends to an internal plane of the second electronic component desired to be connected to the first electronic component. A wire having a melting point higher than the solder used to make the assembly is used to connect the internal plane of the second electronic component to the pad of the second electronic component which second electronic component is to be electrically connected to the first electronic component thereby avoiding a floating signal in the electronic component assembly.

Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site

A method for establishing electrical communication between a first and second object, comprising the steps of 1) obtaining a first object in electrical communication with at least one BLM, each at least one BLM in contact with a high melting point solder ball coated with a low melting point solder, the low melting point solder contacting each solder ball over at least the portion of the solder ball not in contact with the BLM; 2) interacting a second object having at least one attachment point, each at least one attachment point corresponding to at least one solder ball on the first object where electrical communication is desirable, each solder ball and corresponding attachment point are proximally situated such that each solder ball is capable of forming an electrical communication with the corresponding attachment point; and 3) reflowing the first object and the second object while the first object and the second object are interacted, such that the first object and the second object are in electrical communication and are physically connected.

Method for establishing electrical communication between a first object

A method of forming a solder ball structure comprising the steps of 1) obtaining a first object having at least one high melting point solder ball, each solder ball having a corresponding BLM containing a low melting point solder, each solder ball having an outer surface, top and bottom, each BLM having a top and bottom, the bottom of each solder ball in contact with the top of the corresponding BLM over a portion of the outer surface, the bottom of each BLM in electrical communication with the first object; 2) obtaining a template having a first surface; 3) applying a disjoint area of low melting point solder paste to the first surface of the template; 4) interacting the top of each solder ball and the solder paste; and 5) reflowing each solder ball and disjoint area of solder paste while each solder ball and disjoint area of solder paste are interacted.

Method of making a high melting point solder ball coated with a low

A solder ball structure having a first object and least one solder ball, each solder ball having an outer surface, top and a bottom and comprising a non-eutectic admixture of solder. The solder ball structure also having at least one BLM, each BLM having a top and a bottom and the top of each BLM in contact with the bottom of one of the at least one solder ball, each BLM containing a solder having a melting point sufficiently lower than the melting point of the corresponding solder ball such that each BLM can reflow without a significant portion of the corresponding solder ball reflowing, the bottom of each at least one BLM in electrical communication with the first object. The solder ball structure further having at least one solder ball coating, each coating in contact with one of the at least one solder ball over at least the portion of the solder ball surface not in contact with the corresponding BLM; each coating having a melting point sufficiently lower than the melting point of the corresponding solder ball such that each coating can reflow without a significant portion of the corresponding solder ball reflowing.

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Poughkeepsie, NY, United States of America

Brian D Chapman