Microsoft Technology Licensing, LLC

Antenova Limited

Brian Collins

Michael P Gaynor

Marc Harper

Devis Iellici

Simon Philip Kingsley

Timothy John Palmer

Raul Recio Perez

Vijay Nahar

There is disclosed a package comprising at least an integrated circuit embedded in an electrically non-conductive moulded material. The moulded material includes at least one moulded pattern on at least one surface thereof, and at least one electrically conductive track in the pattern. There is further provided at least one capacitive, inductive or galvanic component electrically connecting between at least two parts of the at least one electrically conductive track. The conductive track can be configured as antenna, and the capacitive, inductive or galvanic component is used to adjust tuning and other characteristics of the antenna.

Semiconductor device with integrated antenna and manufacturing method therefor

There is disclosed a module for an antenna system, the module comprising a dielectric support and a branched electrically conductive pathway formed on or in the support. The pathway comprises at least three arms each having a proximal and a distal end, the proximal ends being joined together or each connected to at least one other of the at least three arms, and the distal ends being separate from each other and configured as terminals. The modules may be configured as chip antennas. A plurality of antenna modules can connected together in order to create antenna systems with particular desired characteristics.

Branched multiport antennas

There is disclosed an antenna arrangement comprising an electrically conductive radiating element having first and second ends, an electrically conductive ground plane or ground member, and an input terminal. The radiating element has a plurality of separate feed points at different locations between its first and second ends, and the input terminal is provided with a switch. Each feed point is electrically connected to the switch by way of a separate electrical pathway, the switch being configured to allow the separate feed points to be connected individually or in predetermined combinations to the input terminal by selecting between a plurality of selectable contacts. At least one of the electrical pathways includes a capacitive circuit component connected in series, and at least one other of the electrical pathways includes an inductive circuit component connected in series. The antenna arrangement allows for a high degree of customization and improved matching, and enables good multi-band performance.

Antennas with multiple feed circuits

There is disclosed a package comprising at least an integrated circuit embedded in an electrically non-conductive moulded material. The moulded material includes at least one moulded pattern on at least one surface thereof, and at least one electrically conductive track in the pattern. There is further provided at least one capacitive, inductive or galvanic component electrically connecting between at least two parts of the at least one electrically conductive track. The conductive track can be configured as an antenna, and the capacitive, inductive or galvanic component is used to adjust tuning and other characteristics of the antenna.

There is disclosed a dual band antenna device including a dielectric substrate () having opposed first and second surfaces and a groundplane () on the second surface. A microstrip transmission line () is provided on the first surface, and a dielectric pellet () is mounted on the first surface on the microstrip transmission line (). A bifurcated planar inverted-L antenna (PILA) component () is also mounted on the first surface, the PILA component () having first () and second () arms which extend over and contact a surface of the dielectric pellet (). The first arm () contacts a different area of the surface of the dielectric pellet () than the second arm (). The antenna device provides good operation at both 2.4 GHz and 5.5 GHz frequency bands.

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Cambridge, United Kingdom

Brian Collins