Electro Scientific Industries, Inc.

Brian C Johansen

Mehmet Emin Alpay

David Childers

Jeff Howerton

Brandon John McCurry

Yunlong Sun

Brian W Baird

Hisashi Matsumoto

Weisheng Lei

Kyung Young Kim

Gregg Hardy

Justin Redd

Bruce W Ball

Donald E Wile

Each data point within a two-dimensional code can be represented by a distribution of spots. Each spot can be made small enough to be invisible to the human eye so that the two-dimensional code can be invisible on or within transparent or nontransparent materials. The spots can be spaced at a large distance to increase the signal-to-noise ratio for an optical code reader. A code reader can be adapted to read the spots and determine the data points.

Optical mark reader

An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.

Method and apparatus for laser drilling holes with Gaussian pulses

Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations

Embodiments of an apparatus for measuring the leakage current of capacitive components is taught. One embodiment includes a first stage amplifier configured to receive an input from a serially-connected capacitive component at an inverting input and a feedback resistor in a feedback path of the first stage amplifier. A resistance value of the feedback resistor is programmable based on an expected value of the leakage current and a corresponding voltage output.

Programmable gain trans-impedance amplifier overload recovery circuit

Systems and methods reduce or prevent back-reflections in a laser processing system. A laser processing system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface, and a lens to receive the incident laser beam along a first axis of propagation that is substantially perpendicular to the work surface. The lens includes a primary axis that is substantially parallel to, and offset from, the first axis of propagation. The lens is configured to focus the incident laser beam onto the work surface along a second axis of propagation that forms a non-perpendicular angle with the work surface such that at least a substantial portion of a reflected laser beam from the work surface does not return to the laser beam output.

Reducing back-reflections in laser processing systems

An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailored pulse is a laser pulse that features a power spike having a peak power 10% higher than the average power of the pulse and lasting less than 50% of the duration of the pulse. Methods and apparatuses for creating tailored pulses by slicing longer duration pulses are shown.

Method and apparatus for laser drilling holes with tailored laser pulses

A method and an apparatus for processing workpieces with a laser beam include first and second stages for holding the workpieces and first and second laser beam paths. The first workpiece is loaded upon the first stage, aligned with the first laser beam path, and processing begun. While the first workpiece is aligned in relation to the first laser beam path, the second workpiece is prepared in relation to the second laser beam path. Processing of the second workpiece is begun as soon as the laser beam is available for processing.

Method and apparatus for laser processing

A method and apparatus to improve image quality in images captured via monochromatic cameras using multi-wavelength lighting. A contrast optimization algorithm determines which particular wavelength among those available is most suitable to maximize contrast. The quality of the image can be further improved through active noise cancellation by determining the lighting schemes that provide maximum and minimum contrast between a target and a background. The elimination of image texture data (i.e., noise) is then accomplished through pixel-by-pixel division of the maximum by the minimum contrast image. Alternatively, images obtained using at least two wavelengths can be algebraically combined for noise reduction. The resulting composite image can be fed into any known target identification algorithm.

Growing community of inventors

Hillsboro, OR, United States of America

Brian C Johansen