E.i. Dupont De Nemours and Company

Merck Patent Gmbh

Other

Du Pont Toray Company Limited

E. I. Du Pont De Nemours

E.i. Du Pont De Nmeours and Company

Brian C Auman

John Donald Summers

Edgar Bohm

Thomas Eugene Dueber

Meredith L Dunbar

David P Higley

Melvin P Zussman

Andrew Edward Feiring

Harry Richard Zwicker

William Robert Corcoran

Kuppusamy Kanakarajan

Christopher Dennis Simone

Yueh-Ling Lee

Bernd Fiebranz

Kostantinos Kourtakis

Christian Peter Lenges

Makoto Kaji

Carl Baasun Wang

Akihiro Sasaki

Jiang Ding

John R Dodd

Toshiki Hagiwara

Noriyoshi Arai

Shane Fang

Paul Arthur Meloni

Kirby V Scherer

Michael W J West

Munirpallam Appadorai Subramanian

Peter Francis Carcia

Robert Valentine Kasowski

Bernhard M Wessling

Thomas Edward Carney

Mark A Guidry

Donald Douglas May

Salah Boussaad

Michael W West

Swiatoslaw Trofimenko

Thomas P Gannett

Kenji Uhara

Timothy D Krizan

John A Kreuz

Murty S Tanikella

Tao He

Naofumi Yasuda

Kouichi Sawasaki

Sounak Banerji

Edgar B&ouml;hm

Michael T Pottiger

Carl Robert Haeger

Richard J Boyce

Bruce B Johnson

John C Coburn

Richard A Wessel

William E Estes

Nyrissa S Rogado

Kuppsuamy Kanakarajan

Akio Osabe

James M Sonnett

Richard Frederich Sutton, Jr

In a first aspect, a liquid fluoropolymer coating composition includes a first fluoropolymer selected from homopolymers and copolymers of vinyl fluoride and homopolymers and copolymers of vinylidene fluoride, a second fluoropolymer including a highly fluorinated fluoropolymer having a fluorine content of at least 60 weight percent, a compatible cross-linkable adhesive polymer, a cross-linking agent and solvent. In a second aspect, a fluoropolymer coated film includes a polymeric substrate film and a fluoropolymer coating on the polymeric substrate film. The fluoropolymer coating includes a first fluoropolymer selected from homopolymers and copolymers of vinyl fluoride and homopolymers and copolymers of vinylidene fluoride, a second fluoropolymer including a highly fluorinated fluoropolymer having a fluorine content of at least 60 weight percent and a compatible cross-linked adhesive polymer including functional groups selected from carboxylic acid, sulfonic acid, aziridine, anhydride, amine, isocyanate, melamine, epoxy, hydroxyl, and combinations thereof.

Liquid fluoropolymer coating composition and fluoropolymer coated film

A back-sheet for a photovoltaic module is provided comprising a fire resistant polymeric film and a second polymeric film adhered to the fire resistant polymeric film. The fire resistant polymeric film comprises a polymer that does not melt at temperatures below 275&#xb0; C. and an inorganic particulate filler selected from inorganic metal oxides and inorganic metal nitrides, and combinations thereof. The fire resistant polymeric film contains from 40 to 75 weight percent inorganic particulate filler based on the total weight of the film, and the fire resistant polymeric film has an average thickness of at least 85 microns. A photovoltaic module comprising such a back-sheet is also provided.

Fire resistant back-sheet for photovoltaic module

The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Thin film transistor compositions, and methods relating thereto

A process for forming at least one transistor on a substrate is described. The substrate comprises a polyimide and a nanoscopic filler. The polyimide is derived substantially or wholly from rigid rod monomers and the nanoscopic filler has an aspect ratio of at least 3:1. The substrates of the present disclosure are particularly well suited for thin film transistor applications, due at least in part to high resistance to hygroscopic expansion and relatively high levels of thermal and dimensional stability.

Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250&#xb0; C., a water absorption factor of less than 2%, and a positive solubility measurement.

Composition of polyimide and sterically-hindered hydrophobic epoxy

The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.

Polycyclic polyimides and compositions and methods relating thereto

The present invention is directed to coverlay compositions derived from two-layer polyamic acid-based composites having a cover layer and adjacent thereto an adhesive layer wherein the cover layer comprises polyamic acid and other additives allowing the composition to be photosensitive and aqueous base developable, and where the adhesive layer can form a polyimide having a glass transition temperature between 170 and 250&#xb0; C. The two-layer coverlay compositions of the present invention are used to encapsulate metal circuit traces formed on a flexible printed circuit base substrate. These two-layer compositions are particularity useful due to having an overall in-plane CTE between 10 and 40 ppm/&#xb0; C. a range that is useful in avoiding unwanted curling of a flexible printed circuit when used as a polyimide-based coverlay material.

Polyimide composite coverlays and methods and compositions relating thereto

The present invention relates to electrically conductive polyimide films having dispersed in them electrically conductive polymer particles having an average particle size from 0.5 to 5.0 microns. These films are suitable as image transfer belts in high-speed color copying machines and possess a surface smoothness, Ra factor (microns), between 0.5 and 1.5 and a gloss factor between 70 and 120.

Polyimide based compositions comprising doped polyaniline and methods and compositions relating thereto

Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3',4,4&#x2032;-biphenyltetracarboxylic dianhydride (BDPA) and 2,2&#x2032;-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between &#x2212;5 and +20 ppm/&#xb0; C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g., cellular phones, personal digital assistants, portable video games, laptops, and the like).

Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto

A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.

Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto

The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160&#xb0; C. and up to 200&#xb0; C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.

Low-temperature curable photosensitive compositions

The present invention relates generally to polymer composites having dispersed therein both useful spinel crystal fillers and ferroelectric (and/or paraelectric) fillers wherein the composite is both light activatable and can be used as a planar capacitor material. The light activation is typically employed via a laser beam (or other light emitting device) where the material has a pattern formed thereon. Electrodes are typically formed on the material's surface after patterning is complete via electroless metal plating. These composite polymers can be used as planar capacitors embedded in printed wiring boards or in integrated circuit packages.

Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto

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Newark, DE, United States of America

Brian C Auman