Micron Technology Incorporated

Brett Crump

Ralph Schaeffer

Michael H Martin

John Caldwell

Jerry D McBride

Phil Byrd

The invention includes probe interposers and methods of fabricating pose interposers. In one implementation, a method of fabricating a probe interposer includes providing a substrate having a frontside and a backside. Probe tips are lithographically patterned on the substrate frontside. The probe tips have electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed. Mechanical hard stops are lithographically patterned on the substrate frontside. The mechanical hard stops have outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer. The invention includes probe interposers independent of method of fabrication.

Probe interposers and methods of fabricating probe interposers

Maintaining proper planarity of elements of a microelectronic component test system helps ensure reliable operation of the test system. Aspects of the invention provide test systems and methods for verifying planarity of, for example, a head and a support surface of a microelectronic component test system. In one exemplary method, a probe card is mounted to and electrically coupled to a head of a microelectronic component test system. The probe card has an array of probes. A contact surface of the support is moved with respect to the head and a change in contact condition of each of the probes is recorded in a first data set. The orientation of the probe card with respect to the contact surface is changed, the contact surface is moved with respect to the head again and a change in contact condition of each of the probes is recorded in a second data set.

Planarity diagnostic system, e.g., for microelectronic component test systems

Methods of verifying planarity of a microelectronic component support of a microelectronic component test system with respect to a head of the test system are disclosed herein. In one embodiment, a method includes juxtaposing a probe card with a contact surface that is carried by the microelectronic, component support. The probe card has probes extending toward the contact surface. The method further includes changing a distance along a Z axis between the probe card and the contact surface and recording in a first data set a Z coordinate of the contact surface at which each probe changes a contact condition with respect to a first location on the contact surface. The method also includes spacing the probes from the contact surface, and translating at least one of the probe card and the contact surface with respect to an X-Y plane. Thereafter, the method includes changing a distance along the Z axis between the probe card and the contact surface and recording in a second data set a Z coordinate of the contact surface at which each probe changes a contact condition with respect to a second location on the contact surface which is spaced from the first location, and processing the first data set and the second data set with a processor of the test system to determine a planarity characteristic.

Planarity diagnostic system, E.G., for microelectronic component test systems

Microelectronic components are commonly tested with probe cards. Certain aspects of probes, probe cards, and methods of testing microelectronic components are discussed herein. In one specific example, a probe card includes a base and a probe carried by the base. An actuator is associated with the probe and is adapted to selectively position the probe with respect to an electrical contact on the microelectronic component. A test power circuit is coupled to the first probe and adapted to deliver test power to the first probe. In one exemplary method, an actuator is actuated to move the probe from a first probe arrangement to a second probe arrangement.

Selectively configurable probe structures, e.g., selectively configurable probe cards for testing microelectronic components

Microelectronic components are commonly tested with probe cards. Certain aspects of the invention provide alternative probes, probe cards, and methods of testing microelectronic components. In one specific example, a probe card includes a base and a probe carried by the base. An actuator is associated with the probe and is adapted to selectively position the probe with respect to an electrical contact on the microelectronic component. A test power circuit is coupled to the first probe and adapted to deliver test power to the first probe. In one exemplary method, a microelectronic component is tested by contacting each of a plurality of second probes carried by the probe card to one of a plurality of spaced-apart second contacts on the microelectronic component, thereby aligning each of the first probes with a first contact of the microelectronic component. The second probes may then be moved out of contact with the second contacts while keeping the base of the probe card stationary with respect to the microelectronic component.

Selectively configurable probe structures, e.g., for testing microelectronic components

Microelectronic components are commonly tested with probe cards. Certain aspects of the invention provide alternative probes, probe cards, and methods-of testing microelectronic components. In one specific example, a probe card includes a base and a probe carried by the base. An actuator is associated with the probe and is adapted to selectively position the probe with respect to an electrical contact on the microelectronic component. A test power circuit is coupled to the first probe and adapted to deliver test power to the first probe. In one exemplary method, a microelectronic component is tested by contacting each of a plurality of second probes carried by the probe card to one of a plurality of spaced-apart second contacts on the microelectronic component, thereby aligning each of the first probes with a first contact of the microelectronic component. The second probes may then be moved out of contact with the second contacts while keeping the base of the probe card stationary with respect to the microelectronic component.

Selectively configurable microelectronic probes

Maintaining proper planarity of elements of a microelectronic component test system helps ensure reliable operation of the test system. This disclosure suggests test systems and methods for verifying planarity of, for example, a head and a support surface of a microelectronic component test system. In one exemplary method, a probe card is mounted to and electrically coupled to a head of a microelectronic component test system. The probe card has an array of probes. A contact surface of the support is moved with respect to the head and a change in contact condition of each of the probes is recorded in a first data set. The orientation of the probe card with respect to the contact surface is changed, the contact surface is moved with respect to the head again, and a change in contact condition of each of the probes is recorded in a second data set.

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Boise, ID, United States of America

Brett Crump