Amkor Technology, Inc.

Synaptics Corporation

Amkor Technology Singapore Holding Pte. Ltd.

Brett Arnold Dunlap

Robert Francis Darveaux

Ronald Patrick Huemoeller

Paul Wickboldt

David Bolognia

Bob Shih-Wei Kuo

Shengmin Wen

David Jon Hiner

Guozhong Shen

Ozan Ersan Erdogan

Ahmer Raza Syed

Russell Shumway

Louis B Troche, Jr

Ruben Fuentes

Alexander William Copia

Jay Kim

A biometric sensor may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.

Fingerprint sensor and button combinations and methods of making same

A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Packaging for fingerprint sensors and methods of manufacture

It will be understood by those skilled in the art that there is disclosed in the present application a biometric sensor that may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.

A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.

Method of forming a plurality of electronic component packages

An input device for capacitive sensing includes: a plurality of sensor electrodes, the plurality of sensor electrodes comprising a plurality of transmitter electrodes and a plurality of receiver electrodes, wherein the plurality of transmitter electrodes is configured to be driven by sensing signals and the plurality of receiver electrodes is configured to receive detected signals corresponding to respective sensing signals driven onto the plurality of transmitter electrodes; a plurality of transmitter electrode vias, wherein each transmitter electrode via corresponds to a respective transmitter electrode of the plurality of transmitter electrodes; and conductive shielding, configured to mitigate effects of the plurality of transmitter electrode vias on the detected signals received on one or more receiver electrodes of the plurality of receiver electrodes, wherein the conductive shielding comprises: a first portion disposed above the plurality of transmitter electrode vias; and a second portion disposed outside the plurality of transmitter electrode vias.

Edge-effect mitigation for capacitive sensors

A sensor package and a method of forming a sensor package are disclosed. The sensor package comprises: a multilayer substrate comprising a mold compound layer and a plurality of patterned metal layers; an embedded die embedded in the multilayer substrate, wherein the mold compound layer of the multilayer substrate surrounds the embedded die; and, a sensing element disposed over the multilayer substrate, the sensing element comprising a first patterned metal layer electrically connected to the embedded die through the multilayer substrate.

Semiconductor package for sensor applications

A staggered die MEMS package includes a substrate having a converter cavity formed therein. A converter electronic component is mounted within the converter cavity. Further, a MEMS electronic component is mounted to both the substrate and the converter electronic component in a staggered die arrangement. By staggering the MEMS electronic component directly on the converter electronic component instead of locating the MEMS electronic component in a side by side arrangement with the converter electronic component, the total package width of the staggered die MEMS package is minimized. Further, by locating the converter electronic component within the converter cavity and staggering the MEMS electronic component directly on the converter electronic component, the total package height, sometimes called Z-height, of the staggered die MEMS package is minimized.

Stacked and staggered die MEMS package and method

A redistribution pattern is formed on active surfaces of electronic components while still in wafer form. The redistribution pattern routes bond pads of the electronic components to redistribution pattern terminals on the active surfaces of the electronic components. The bond pads are routed to the redistribution pattern terminals while still in wafer form, which is a low cost and high throughput process, i.e., very efficient process.

Growing community of inventors

Queen Creek, AZ, United States of America

Brett Arnold Dunlap