Harris Corporation

Brett A Pigon

Walter M Whybrew

Gary A Rief

James B Nichols

Gregory M Jandzio

Donald J Beck

Steven E Wilson

Kelly V Hillman

James Joseph Rawnick

Stephen B Brown

Douglas E Heckaman

Steven Robert Snyder

Raymond Charles Rumpf

William Edward Clark

Ying-Ming Lee

Edward J Bajgrowicz

Jay D Warshowsky

Brinnan C Riley

Randy Eugene Boozer

Hector Deju

David M Holaday

Erik Granholm

Thomas K Buschor

Steven R Sprinkle

Interconnect feed devices () are provided for electrically connecting first and second electrical components (). The interconnect feed devices () can include a dielectric shell () with an electrically-conductive coating (), and leads () positioned within individual conduits () of the shell. Each lead () and its associated conduit () can act as a coaxial cable for transmitting radio frequency (RF) energy between the first and second electrical components (). The shell () can be manufactured using a process, such as stereolithography, that allows the shell to be formed with relatively complicated geometries, which in turn can facilitate relatively complicated cable routing.

Interconnect feed devices for electrical components, and processes for manufacturing same

Method and apparatus for producing a variable delay for an RF signal. The method can include the step of propagating the RF signal along an RF transmission line, coupling a fluidic dielectric to the RF transmission line, and dynamically changing a composition of the fluidic dielectric to selectively vary its permittivity in response to a time delay control signal. The method can also include the step of dynamically changing a composition of the fluidic dielectric to vary its permeability. The permittivity and the permeability can be varied concurrently in response to the time delay control signal. In a preferred embodiment the method can include selectively varying the permeability concurrently with the permittivity to maintain a characteristic impedance of the transmission line approximately constant.

RF delay lines with variable composition fluidic dielectric

A multi-beam phased array antenna architecture includes a plurality of antenna modules, stacked together in a side-by-side relationship. Mutually adjacent edges of the modules have antenna elements that form a two-dimensional antenna array as a result of the stacking of the antenna modules. Opposite sides of an antenna module are tray-configured and contain amplifier modules coupled to the antenna elements, and to 'vertical' microstrip layers on undersides of double-sided printed wiring boards. Outersides of the double-sided printed wiring boards contain 'horizontal' microstrip layers, one for each beam, to which multiple beam-associated phase shift circuit elements for each antenna element on the module are ported. The phase shift circuit elements are also coupled by conductive vias to the first microstrip layers. The second microstrip layers are coupled to connectors along second edges of the modules for engagement with beam signal network modules.

Spatially orthogonal signal distribution and support architecture for multi-beam phased array antenna

A phased array antenna includes an antenna housing having a subarray assembly that supports beam forming network modules and an array face defining a ground plane substantially orthogonal to the subarray assembly. A plurality of millimeter wavelength patch antenna elements are positioned on the array face and each positioned adjacent a respective subarray assembly. The millimeter wavelength patch antenna elements each include a driven antenna element having a front and rear side and a parasitic antenna element positioned forward of the front side of the driven antenna element. A microstrip quadrature-to-circular polarization circuit is positioned rearward of the rear side of the driven antenna element and operatively connected to the driven antenna element. A single millimeter wavelength feed operatively connects the microstrip quadrature-to-circular polarization circuit with a respective adjacent beam forming network module supported on the orthogonal positioned subarray assembly.

Phased array antenna having stacked patch antenna element with single millimeter wavelength feed and microstrip quadrature-to-circular polarization circuit

A modular antenna architecture includes a plurality of joined-together flat, laminate-configured antenna sub-panels, in which RF signal processing (RF amplifier) modules are embedded within a very lightweight, honeycomb-configured support member, upon which respective antenna sub-array and control, power and beam steering signal distribution networks are respectively mounted. The thickness of the honeycomb-configured support member-embedded is sized relative to the lengths of the RF signal processing modules such that input/output ports at opposite ends of the RF modules are substantially coplanar with conductor traces on the front and rear facesheets, so that the RF modules provide the functionality of RF feed-throughs to provide RF signal coupling connections between the rear and front facesheets of the antenna sub-panel.

Lightweight antenna subpanel having RF amplifier modules embedded in

A thermosonic ribbon bonding process uses a combination of a relatively low temperature and a high frequency to bond a ribbon conductor to conductive bonding sites of a system level support structure, such as a space/airborne antenna, containing circuit components whose characteristics might otherwise be degraded at an elevated temperature customarily used in device-level thermosonic bonding processes. By relatively low temperature is meant a temperature no greater than the minimum temperature that would potentially cause a modification of the circuit parameters of at least one of the system's components. Such a minimum temperature may lie in a range on the order of 25-85.degree. C., while the ultrasonic bonding frequency preferably lies in a range of from 122 KHz to 140 KHz. For gold ribbon to gold pad bonds, this high frequency range achieves the requisite atomic diffusion bonding energy, without causing fracturing or destruction of the gold ribbon or its interface with the gold pad.

High frequency, low temperature thermosonic ribbon bonding process for

Growing community of inventors

Palm Bay, FL, United States of America

Brett A Pigon