City Labs, Inc.

Other

Bret J Elkind

Peter Cabauy

Jesse Grant

Larry C Olsen

Denset Serralta

A device for producing electricity. The device includes a substrate having spaced apart first and second surfaces and doped a first dopant type, first semiconductor material layers disposed atop the first substrate surface and doped the first dopant type, and second semiconductor material layers disposed atop the first semiconductor material layers and doped a second dopant type. A first contact is in electrical contact with the second substrate surface or in electrical contact with one of the first semiconductor material layers. A beta particle source emits beta particles that penetrate into the semiconductor material layers; the beta particle source is proximate the uppermost layer of the second plurality of semiconductor material layers. A second contact is in electrical contact with one of the second plurality of semiconductor material layers. In one embodiment, bi-polar contacts (the first and second contacts) are co-located on each major face of the device.

Series and/or parallel connected alpha, beta, and gamma voltaic cell devices

A betavoltaic power source. The power source comprises a source of beta particles and a plurality of regions each for collecting the beta particles and for generating electron hole pairs responsive to the beta particle flux. A first set of the plurality of regions is disposed proximate a first surface of the source and a second set of the plurality of regions is disposed proximate a second surface. The first and second surface in opposing relation. A secondary power source is charged by a current developed by the electron hole pairs.

Small form factor betavoltaic battery for use in applications requiring a volumetrically-small power source

An assembly carrying a radioisotope power source for attaching to a printed circuit board. The assembly comprises an integrated circuit package carrying an integrated circuit, the integrated circuit package having first contacts on a lower surface thereof, the integrated circuit requiring connection to a power source, a power source package defining a cavity therein for carrying the radioisotope power source, the power source package having second contacts on an upper surface thereof contacting the first contacts and having third contacts on a lower surface thereof for contacting fourth contacts on the printed circuit board, the power source package having conductive vias extending from the second contacts on the upper surface of the power source package to the third contacts on the lower surface of the power source package, one or more of the vias having a fan-in segment, a fan-out segment and a substantially vertical segment therebetween, and electrical signals passing between the integrated circuit and the printed circuit board through the conductive vias and power passing from the radioisotope power source into the integrated circuit through one or more of the substantially vertical segments and the fan out segments.

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Homestead, FL, United States of America

Bret J Elkind