Palo Alto Research Center Inc.

Xerox Corporation

Brent Shawhan Krusor

Ping Mei

Christopher L Chua

Jurgen Hans Daniel

Noble Marshall Johnson

Robert Anthony Street

Gregory Lewis Whiting

Steven E Ready

Tse Nga Ng

Thomas Wunderer

Naveen Chopra

Gabriel Iftime

Peter Michael Kazmaier

Linda T Romano

David Eric Schwartz

Thomas Hantschel

Janos Veres

San-Ming Yang

Michael C Weisberg

Jonathan Rivnay

David Kalman Biegelsen

Yiliang Wu

David P Bour

David Kirtland Fork

Raj B Apte

Adela Goredema

William S Wong

Jeng Ping Lu

Michael A Kneissl

Jengping Lu

Ana Claudia Arias

John Stuart Fitch

Dirk De Bruyker

Scott J Limb

Jack A Walker

Bowen Cheng

Qian Wang

Yong Zhang

William Wong

Sivkheng Kor

Chinnwen Shih

Alexandra Rodkin

Rose M Wood

Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.

Bare die integration with printed components on flexible substrate without laser cut

Development of smart objects with electronic functions requires integration of printed components with IC chips or dies. Conventional chip or die bonding including wire bonding, flip chip bonding, and soldering may not be applicable to chip or die attachment on low temperature plastic surfaces used in physical objects. Printing conductive connection traces requires a smooth interface between contact pads of a chip and the surface of the physical object. In order to address this issue of chip/die attachment to a physical object, this disclosure provides embodiments to construct a fixture on a chip or die for attachment and electrical connection onto a physical object by printing operations and/or ACF bonding methods.

Method and fixture for chip attachment to physical objects

A printed resistive gas detector configuration that is simple, inexpensive and compact, fabricated for incorporation into an electronic device, such as an electronic computing and/or communication device, the printed resistive gas detector configuration designed to continuously monitor for predetermined types of gasses. The printed resistive gas detector configuration manufactured by the use of printing technology to print on a flexible substrate.

Printed gas sensor

Methods and system which eliminate steps in the mounting a discrete device to an electronic circuit using a conductive film, shortening the time required to attach each discrete device. The methods place a discrete device onto the conductive tape and partially cure portions of the adhesive. The discrete device is then removed from the conductive tape along with the adhesive and conductive particles which have been transferred onto the contact pads of the discrete device. The discrete device is then placed on the substrate and aligned. Pressure and heat are applied to complete the bond.

Method for bonding discrete devices using anisotropic conductive film

Electronic devices having two or more conductive contacts or terminals and methods of making the same. Including having a conducting interconnect line coated with an insulator stack (functionalized to be hydrophobic), cut&#x2014;simultaneously allowing for one step, self-aligned, patterning of formed conducting contacts and the insulation stack. The combination of the cut in the insulation, along with the low surface energy of the insulating surface allow for active material to be deposited at the cut site defining the channel.

Electrochemical device with self-aligned insulation

A material deposition system and method is disclosed for depositing material onto raised features on a surface of a substrate. The material deposition system and method are a contact deposition or printing system and method, which employs biased rollerball to deposit the material as it travels along the substrate and over the raised features.

Spring loaded rollerball pen for deposition of materials on raised surfaces

A hybrid electronic assembly includes a substrate having conductive circuit tracings, and includes at least one opening defined within length and width dimensions of the substrate. An electronic circuit component which has conductive circuit tracings, and is located within the at least one opening of the substrate. An alignment area where a first surface of the substrate and a first surface of the electronic circuit component are aligned in a substantially planar flat relationship with the electronic circuit component. A non-alignment area where a second surface of the substrate and a second surface of the electronic circuit component are in a non-aligned relationship. A bonding material formed on at least a portion of the second surface of the substrate and on at least a portion of the electronic circuit component and where conductive traces are formed between the first surface of the substrate and the first surface of the electronic circuit component, providing electrical connections between the substrate and the electronic circuit component.

Bare die integration with printed components on flexible substrate

The present application provides methods, systems and devices for simultaneously bonding multiple semiconductor chips of different height profiles on a flexible substrate.

Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste

Printed flexible hybrid electronic systems may require electrical interconnection to peripheral elements. For example, a printed sensor tag with wireless communication may need to connect to a printed sensing electrode on a separated substrate. Frequently, it is desired that these interconnections be detachable in order to replace peripheral elements or to facilitate low cost and simplified assembly, test, rework, and repair. Unlike conventional printed circuit board, mounting a connector on a flexible substrate for detachable connection is challenging due to low temperature requirements. Provide is a teaching of a thin film or form of electrical connection for two circuit elements on separate flexible substrates. The connection is detachable and re-attachable for replacing different circuit elements. The detachable connection is in embodiments realized by selective deposition of fine patterns of conductive materials and non-conductive repositionable pressure-sensitive adhesive.

Detachable flex-to-flex electrical connection

A method for forming an out of plane structure includes depositing a layer of an elastic material on a substrate wherein the elastic material has an intrinsic stress profile. The layer of elastic material is photolithographically patterned into at least two spaced-apart elastic members. An electrically non-conductive tether layer joins the elastic members. A portion of the substrate is etched under the elastic members to release a free end of each elastic member, while leaving an anchor portion of each elastic member fixed to the substrate. The stress profile of the elastic members biases the free ends of the elastic members away from the substrate forming loops. The structure is electroplated by applying a voltage having a first polarity between an anode and the structure while the structure is in an electroplating bath. Subsequent to the electroplating, the polarity of the voltage between the anode and the structure is reversed.

Out of plane structures and methods for making out of plane structures

Disclosed is an integrated circuit arrangement including a two sided circuit board, having a first surface and a second surface. A plurality of electrical conductors is incorporated as part of the two sided circuit board. An array of through holes extend through the first surface and the second surface, arranged in a pattern and are configured to provide a common electrical connection area, wherein the common electrical connection area is associated with a portion of a particular one of the plurality of electrical conductors.

Through hole arrays for flexible layer interconnects

A device includes one or more reflector components. Each reflector component comprises layer pairs of epitaxially grown reflective layers and layers of a non-epitaxial material, such as air. Vias extend through at least some of the layers of the reflector components. The device may include a light emitting layer.

Gap distributed Bragg reflectors

An article includes a support substrate bonded to heterostructure epitaxial layers that include one or more electronic devices. The support substrate has a bonding surface and the heterostructure epitaxial layers have a surface with the epitaxial growth direction of the heterostructure epitaxial layers towards the surface. The surface of the heterostructure epitaxial layers is bonded at the bonding surface of the support substrate by ion exchange between the surface of the heterostructure epitaxial layers and the bonding surface of the support substrate.

Integration of semiconductor epilayers on non-native substrates

A process including selecting a printing system; selecting an ink composition having ink properties that match the printing system; depositing the ink composition onto a substrate to form an image, to form deposited features, or a combination thereof; optionally, heating the deposited features to form conductive features on the substrate; and performing a post-printing treatment after depositing the ink composition.

Gravure printing process using silver nanoparticle inks for high quality conductive features

Growing community of inventors

Fremont, CA, United States of America

Brent Shawhan Krusor