Lsi Logic Corporation

Brent R Bacher

Sutee Vongfuangfoo

Minh N Vuong

Atila Mertol

Felipe Sumagaysay

Apparatus and method for assembling solder balls in a selected one of several different patterns for delivery to connector pads on an integrated circuit package, or other receiver, includes a universal template containing holes at locations in an aggregate pattern of all hole locations for the several different patterns, and includes a subtemplate for each individual different pattern that contains posts at locations for insertion from the rear of the template into holes therein at locations where no surface recess is desired. The universal template may remain aligned with an assembly jig or holder of packages while only the subtemplate is changed to change the surface pattern of holes into which solder balls may then be distributed.

Integrated circuit packaging apparatus and method

An electronic semiconductor device package, the package having: a substrate having a top and bottom surface and having traces; a die attached to the top surface of the substrate; first level interconnects of the die to the traces of the substrate; encapsulant which covers the die and first level interconnects; and a lid attached to the encapsulant, wherein the lid comprises at least one lid support which extends from the lid to the substrate. A fixture for attaching a lid to an electronic semiconductor device package, the package having: a substrate having a top surface and a bottom surface and having traces, a die attached to the top surface of the substrate, first level interconnects of the die to the traces of the substrate, and the fixture having: an interior opening for receiving the lid and package, wherein the interior opening comprises first and second walls, wherein the first wall of the interior opening corresponds to an outside dimension of the substrate and wherein the second wall corresponds to an outside dimension of the lid. A method of attaching a lid to an electronic semiconductor device package, the package having: a substrate having a top surface and a bottom surface and having traces, a die attached to the top surface of the substrate, first level interconnects of the die to the traces of the substrate, and the method having: inserting a lid into a fixture, wherein the fixture comprises an interior opening for receiving the lid and package wherein the interior opening has a first wall corresponding to a dimension of the substrate and a second wall corresponding to a dimension of the lid; applying adhesive between the lid and package; and inserting a package into the fixture.

Fixture for lid-attachment for encapsulated packages

A PBGA package includes PBGA member, a stiffener ring, and a stiffener fixture which includes a retaining recess having a floor for receiving the stiffener ring and includes a ledge positioned above the recess floor for receiving the PBGA member. An adhesive layer is applied to the stiffener ring, which is adhered to the PBGA member. The stiffener ring and PBGA member are essentially coplanar to less than 8 mils. A top plate is placed on top of the PBGA member and the ring and member are secured together tightly.

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Los Alamitos, CA, United States of America

Brent R Bacher