Licon Technology Corporation

Daewon Semiconductor Packaging Industrial Company

Other

Brent Dae Hermsmeier

Matthew Whitlock

Andrew Peter Davis

William Reed

Sunna Chung

Athens Okoren

James A Allen, Jr

Jonathan Kevin Lie

Introduced here are carrier assemblies designed to address the limitations of conventional carrier trays. A carrier assembly can comprise a primary injection-molded component having a deck area for receiving semiconductor components and a secondary injection-molded component that is secured to the deck area of the primary injection-molded component. For example, the secondary injection-molded component may be overmolded on the deck area of the primary injection-molded component. The secondary injection-molded component may have a tacky upper surface that facilitates securement of the semiconductor components to the primary injection-molded component.

Rigid carrier assemblies with tacky media molded thereon

Introduced here are carrier assemblies that include a rigid tray having a deck area with a patterned surface of cavities for receiving semiconductor components. The cavities can be designed to accommodate semiconductor components of different form factors (e.g., having different shapes, sizes, etc.). Moreover, an adhesive film can be affixed to the deck area to ensure that the semiconductor components are securely held against the top surface of the rigid tray. In some instances the adhesive film substantially conforms to the deck area, while in other instances the adhesive film extends across the opening of each cavity located in the deck area. Semiconductor component(s) can be secured to the carrier assembly based on the adhesiveness provided by the adhesive film, mechanical force provided the cavities, electrostatic force provided by the cavities, or any combination thereof.

Patterned carrier assemblies having an integrated adhesive film

A power supply for a smooth power output level transitioning includes an energy storage circuit for temporarily storing electric energy for driving a load, a semiconductor switch for pulse-width modulation (PWM) switching, and a digital PWM controller. The digital PWM controller generates a driving waveform to regulate on and off status of the semiconductor switch. The driving waveform toggles between PWM periods of a first type and PWM periods of a second type, and gradually adjusts a ratio of numbers of the PWM periods of the two types over time. The toggling driving waveform achieves one or more intermediate finer power output level that cannot be realized by a single type of PWM period with an intermediate duty cycle, due to the minimum item unit of the driving waveform limited by a clock rate of the digital PWM controller.

Quasi-analog digital pulse-width modulation control

A power supply circuitry compatible with both source type dimmer controls and sink type dimmer controls is provided. The power supply circuitry includes an internal voltage source, a dimmer control type detection circuit, and a configuration circuit. The dimmer control type detection circuit detects a type of a dimmer control that is electrically coupled to the power supply circuitry. The configuration circuit can turn off the internal voltage source upon determining the dimmer control is of the sink type and turn on the internal voltage source upon determining the dimmer control is of the source type. Thus, the internal voltage source may generate a voltage as the dimming control signal. The dimming control signal is fed to a microcontroller that may, for example, generate a series of pulse signals that is provided to a power converter of a load (e.g., light-emitting diode luminaries) based on the dimming control signal.

Universal LED dimmer with extended application range

A complementary converter is a switch mode converter circuit that uses one pulse-width modulation (PWM) controller and one power MOSFET to run a two-stage power-factor-corrected (PFC) power supply. The two-stage power-factor-corrected power supply can include a power-factor-corrected boost converter, and a DC-to-DC converter (either step-up or step-down). The DC-to-DC converter can be, e.g., a Flyback, Forward, Cuk, or Buck Converter. The complementary converter circuit includes a voltage input section that takes a universal Vinput and rectifies the input. Then the PFC boost converter boosts the rectified half-cycle DC to a DC line at a higher voltage. The complementary converter circuit further includes an integrated circuit with the power-factor-correction and PWM switching capabilities to control the converters. The DC-to-DC converter brings the voltage down to an appropriate level for the final load (e.g., LEDs).

Growing community of inventors

Santa Clara, CA, United States of America

Brent Dae Hermsmeier