Silicon Light Machines Corporation

3M Innovative Properties Company

Teravicta Technologies, Inc.

Brent D Lunceford

James A Hunter

Gregory Beach

Douglas B Gundel

David T Amm

Omar Sze Leung

Alexander P Payne

Ravi Palaniswamy

Justine A Mooney

Michael J Dueweke

John D Geissinger

Siang Sin Foo

Wilhelmus Adrianus De Groot

Phillip J Bergeron

A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.

MEMS devices on flexible substrate

In one embodiment disclosed, a light modulator can be configured to have a substantially flat optically active modulator element portion while deflected. The modulator can include a plurality of modulator elements arranged substantially in parallel, with each modulator element including an optically active portion and a support portion on either side of the optically active portion. Further, the optically active portion can have a narrower width than the support portion. In another embodiment disclosed, a movable membrane for light modulation includes a substantially circular optically active portion and a released membrane portion surrounding the circular optically active portion. The substantially circular optically active portion can also include a plurality of gaps configured to expose a lower surface. Further, the substantially circular optically active portion can be essentially flat while in a deflected state.

Diffractive light modulator

In one embodiment, a method of forming a metallic electrode comprises depositing a metal layer over a surface (e.g., substrate) and thermally processing the metal layer to form a conductive metallized ceramic. The metal layer may be deposited by sputtering and thermally processed by rapid thermal processing, for example. Among other advantages, embodiments of the present invention allow for the formation of conductive metallized ceramics, such as titanium-nitride, without the use of relatively expensive deposition tools.

Conductive etch stop for etching a sacrificial layer

The present invention provides an improved fluorinated polymer encapsulant for protectively coating electronic devices in an electronic device module. Also provided is a method for applying and reworkably removing the same to and from the electronic device module. In one embodiment, a coating of a fluorinated polymer solution is applied to at least a portion of an electronic device module. The module is then baked to operably fix to it the fluorinated polymer coating.

Method of reworkably removing a fluorinated polymer encapsulant

Growing community of inventors

Austin, TX, United States of America

Brent D Lunceford